Voltage-induced material removal for electrochemical mechanical planarization of copper in electrolytes containing NO3-, glycine, and H2O2

Electrochemical and Solid-State Letters

Volumn 8, Issue 8, 2005, Pages

  Goonetilleke, P C ^a   Babu, S V ^a   Roy, D ^a  

^a CLARKSON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC MATERIALS; ELECTROCHEMISTRY; ELECTROLYTES; HYDROGEN PEROXIDE; LARGE SCALE SYSTEMS;

ELECTROCHEMICAL MECHANICAL PLANARIZATION (ECMP); GLYCINE; INTERCONNECT STRUCTURES; LOW-PRESSURE PLANARIZATION;

COPPER;

EID: 24344443576     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1940488     Document Type: Article

References (7)

1. P. B. Zantye, A. Kumar, and A. K. Sikder, Mater. Sci. Eng., R., 45, 89 (2004).
2. http://www.clarkson.edu/~samoy/ECMP
3. L. Chen, Semiconductor Fabtech, 24th ed., p. 137, Fabtech.org, London (2004).
4. P. C. Goonetilleke and D. Roy, Mater. Chem. Phys., In press.
5. J. Lu, J. E. Garland, C. M. Pettit, S. V. Babu, and D. Roy, J. Electrochem. Soc., 151, G717 (2004).
6. J. E. Garland, C. M. Pettit, and D. Roy, Electrochim. Acta, 49, 2623 (2004).
7. S. Aksu and F. Doyle, J. Electrochem. Soc., 149, G352 (2002).