Voltage pulse-modulated electrochemical removal of copper surface layers using citric acid as a complexing agent

Materials Letters

Volumn 61, Issue 2, 2007, Pages 380-383

  Goonetilleke, P C ^a   Roy, D ^a  

^a CLARKSON UNIVERSITY   (United States)

Author keywords

Copper; Corrosion and oxidation; ECMP; Electronic materials; Surfaces

Indexed keywords

COMPLEXATION; COPPER; ELECTRIC POTENTIAL; ELECTROCHEMISTRY; INORGANIC ACIDS; OXIDATION; SURFACES;

ELECTROCHEMICAL MECHANICAL PLANARIZATION (ECMP); ELECTRONIC MATERIALS; VOLTAGE PULSE MODULATION;

COPPER CORROSION;

EID: 37849187068     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matlet.2006.04.066     Document Type: Article

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