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Volumn 63, Issue 5, 1999, Pages 565-568
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Effect of Au coating on the wettability of Cu substrate by Sn-Ag eutectic solder
a
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Author keywords
[No Author keywords available]
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Indexed keywords
CONTACT ANGLE;
COPPER;
EUTECTICS;
GOLD;
INTERFACES (MATERIALS);
INTERMETALLICS;
SOLDERING ALLOYS;
SUBSTRATES;
SURFACE TENSION;
WETTING;
GOLD COATING;
LEAD FREE;
MENISCOGRAPH TESTING MACHINE;
TIN SILVER EUTECTIC SOLDER;
WETTABILITY;
COATINGS;
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EID: 0032623876
PISSN: 00214876
EISSN: None
Source Type: Journal
DOI: 10.2320/jinstmet1952.63.5_565 Document Type: Article |
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Times cited : (5)
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References (9)
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