Package to board interconnection shear strength (PBISS) behavior at high strain rates approaching mechanical drop

Proceedings - Electronic Components and Technology Conference

Volumn 2, Issue , 2004, Pages 1263-1270

  Hanabe, Murali ^a   Canumalla, Sridhar ^a  

^a NOKIA RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BALL GRID ARRAY (BGA) PACKAGES; MECHANICAL DROP; PACKAGE TO BOARD INTERCONNECTION SHEAR STRENGTH (PBISS); SHOCK LOADING;

DEFORMATION; FAILURE ANALYSIS; FRACTURE MECHANICS; LOADS (FORCES); MECHANICAL TESTING; PRINTED CIRCUIT BOARDS; SHEAR STRENGTH; SOLDERING ALLOYS; STRAIN RATE;

CHIP SCALE PACKAGES;

EID: 10444224640     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

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