The effect of IMC microstructure of solder joint on the mechanical drop performance in SnxAgCu and SnAgCuX CSP package

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 1935-1939

  Lai, Yi Shao ^a   Chen, P C ^a   Yeh, Chang Lin ^a   Lee, Jeffrey C B ^b  

^a ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

^b IST Integrated Service Technology   (Taiwan)

Author keywords

CSP; Electrolytic NiAu; IMC; IMC microstructure; Mechanical drop performance; ROHS; SnAgCu; Thermal aging

Indexed keywords

ELECTRONIC EQUIPMENT MANUFACTURE; INTERFACES (MATERIALS); INTERMETALLICS; MICROSTRUCTURE; MORPHOLOGY; PRINTED CIRCUIT BOARDS;

CSP; ELECTROLYTIC NIAU; IMC MICROSTRUCTURES; MECHANICAL DROP PERFORMANCE; ROHS; SNAGCU; THERMAL AGING;

SOLDERED JOINTS;

EID: 33845590592     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645926     Document Type: Conference Paper

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