Effects of testing conditions and multiple reflows on cold bump pull test of Pb-free solder balls

2005 6th International Conference on Electronics Packaging Technology

Volumn 2005, Issue , 2005, Pages

  Song, Fubin ^a   Lee, S W Ricky ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

BRITTLE FRACTURE; FAILURE (MECHANICAL); INTERFACES (MATERIALS); MATERIALS TESTING; STRENGTH OF MATERIALS;

BALL PULL TESTS; PLASTIC BALL GRID ARRAY (PBGA); SHEAR TESTING;

SOLDERED JOINTS;

EID: 33846291380     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2005.1564698     Document Type: Conference Paper

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