SCOPUS 정보 검색 플랫폼

Volumn 24, Issue 10, 1995, Pages 1429-1434

The role of Cu-Sn intermetallics in wettability degradation

Author keywords

Cu Sn intermetallics; oxidation; solder; wettability

Indexed keywords

COPPER ALLOYS; DEGRADATION; MICROSTRUCTURE; OXIDATION; OXIDES; SURFACE PROPERTIES; TIN ALLOYS; WETTING;

AGED SAMPLES; WETTABILITY DEGRADATION;

INTERMETALLICS;

EID: 0029389630 PISSN: 03615235 EISSN: 1543186X Source Type: Journal
DOI: 10.1007/BF02655460 Document Type: Article

Times cited : (27)

References (20)

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7
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- H.S. Linch (Reynolds), M.S. Thesis, University of California at Berkeley, Dec. (1993).

8
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- 2nd ed., Electrochemical Publications Limited, Ayr, Scotland
- (1989) Soldering in Electronics
- Klein-Wassinik, R.J.¹

15
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- M.J., Cieslak, D., Gupta, M.J., Glicksman, J.H., Perepezko, TMS, Warrendale, PA
- (1993) Proc. of Sym. from TMS Solidif. Com.
- Boettinger, W.J.¹ Handwerker, CA.² Smith, L.C.³

16
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- F.G., Yost, F.M., Hosking, D.R., Frear, Van Nostrand Reinhold, New York
- (1993) Solder Mechanics Wetting and Spreading , pp. 103
- Boettinger, W.J.¹ Handwerker, C.A.² Kattner, U.R.³

18
- 84936498805
- F.G., Yost, F.M., Hosking, D.R., Frear, Van Nostrand Reinhold, New York
- (1993) Solder Mechanics-Wetting and Spreading , pp. 155
- Tench, D.M.¹

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.