Aluminum-nitride thin-film heatspreaders integrated in bipolar transistors

EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems

Volumn , Issue , 2008, Pages

  La Spina, Luigi ^a   Marano, Ilaria ^b   d'Alessandro, Vincenzo ^b   Schellevis, Hugo ^a   Nanver, Lis K ^a  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

^b UNIVERSITY OF NAPLES FEDERICO II   (Italy)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; ALUMINUM COATINGS; BIPOLAR INTEGRATED CIRCUITS; MICROELECTRONICS; NITRIDES; SILICON WAFERS; THIN FILM CIRCUITS;

ALUMINUM NITRIDE LAYER; ALUMINUM NITRIDE THIN FILMS; HEATSPREADERS; REFERENCE DEVICES; SILICON ON GLASS;

ALUMINUM NITRIDE;

EID: 49249093589     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2008.4525061     Document Type: Conference Paper

References (22)

1. K. Banerjee, S.-C. Lin, and N. Srivastava, "Electrothermal engineering in the nanometer era: from devices and interconnects to circuits and systems," in Proc. ASP-DAC, 2006, pp. 223-230.
2. R. H. W. Pijnenburg, R. Dekker, C. C. S. Nicole, A. Aubry, E. H. E. C. Eummelen, "Integrated microchannel cooling in silicon," in Proc. IEEE ESSDERC, 2004, pp. 129-132.
3. D. S. Kercher, J.-B. Lee, O. Brand, M. G. Allen, and A. Glezer, "Microjet cooling devices for thermal management of electronics," IEEE Trans. Comp. Pack. Tech., 26, 2, pp. 359-366, 2003.
4. R. C. Chu, R. E. Simons, M. J. Ellsworth, R. R. Schmidt, and V. Cozzolino, "Review of cooling technologies for computer products," IEEE Trans. Dev. Mat. Reliab., 4, 4, pp. 568-585, 2004.
5. L. K. Nanver et al., "A back-wafer contacted silicon-on-glass integrated bipolar process - Part I: The conflict electrical versus thermal isolation," IEEE Trans. El. Dev., 51, 1, pp. 42-50, 2004.
6. L. La Spina, L. K. Nanver, E. Iborra, M. Clement, J. Olivares, and H. Schellevis, "Characterization of PVD aluminum nitride for heat spreading in RF IC's," in Proc. IEEE ESSDERC, Munich, Germany, 11-13 September 2007, pp. 354-357.
7. Comsol Multiphysics, User's guide, Comsol AB, 2007.
8. L. La Spina, H. Schellevis, N. Nenadović, and L. K. Nanver, "PVD aluminium nitride as heat spreader in silicon-on-glass technology," in Proc. IEEE MIEL, 2006, pp. 365-368.
9. N. Nenadović et al., "A back-wafer contacted silicon-on-glass integrated bipolar process - Part II: A novel analysis of thermal breakdown," IEEE Trans. El. Dev., 51, 1, pp. 51-62, 2004.
10. S. R. Mirmira and L. S. Fletcher, "Review of the thermal conductivity of thin films," J. ThermoPhys. Heat Transfer, 12, 2, pp. 121-131, 1998.
11. S.-M. Lee and D. G. Cahill, "Heat transport in thin dielectric films," J. Appl. Phys., 81, 6, pp. 2590-2595, 1997.
12. A. Irace and P. M. Sarro, "Measurements of thermal conductivity and diffusivity of single and multi-layer membranes," Sensors and Actuators, vol. A76, no. 1-3, pp. 323-328, 1999.
13. N. Sabaté et al., "Characterization of thermal conductivity in thin film multilayered membranes," Thin Solid Films, 484, pp. 328-333, 2005.
14. Taurus TSUPREM-4, User guide, Synopsys, 2004.
15. W. D. van Noort, and R. Dekker, "Thermal resistance of (H)BTs on bulk Si, SOI, and glass," in Proc. IEEE BCTM, 2003, pp. 129-132.
16. P. Deixler et al., "QUBiC4Plus: A cost effective BiCMOS manufacturing technology with elite passive enhancement optimized for 'silicon-based' RF-system-in-package environment," in Proc. IEEE BCTM, 2005, pp. 272-275.
17. B. G. Malm, E. Haralson, T. Johansson, and M. Östling, "Self-heating effects in a BiCMOS on SOI technology for RFIC applications," IEEE Trans. El. Dev., 52, 7, pp. 1423-1428, 2005.
18. J.-S. Rieh, D. Greenberg, Q. Liu, A. J. Joseph, G. Freeman, and D. C. Ahlgren, "Structure optimization of trench-isolated SiGe HBTs for simultaneous improvements in thermal and electrical performances," IEEE Trans. El. Dev., 52, 12, pp. 2744-2752, 2005.
19. 0.47As/InP double HBTs on GaAs substrates," IEEE El. Dev. Lett., 53, 6, pp. 297-299, 2002.
20. 1-xP metamorphic buffer," IEEE Trans. El. Dev., 51, 8, pp. 1221-1227, 2004.
21. L. La Spina, N. Nenadović, V. d'Alessandro, L. K. Nanver, and N. Rinaldi, "FEAT - A simulation tool for electrothermal analysis of multifinger bipolar transistors," in Proc. IEEE EUROCON, 2005, pp. 879-882.
22. N. Rinaldi and V. d'Alessandro, "Theory of electrothermal behavior of bipolar transistors: Part III - Impact Ionization," IEEE Trans. El. Dev., 53, 7, pp. 1683-1697, 2006.