Characterization of PVD aluminum nitride for heat spreading in RF IC's

ESSDERC 2007 - Proceedings of the 37th European Solid-State Device Research Conference

Volumn 2007, Issue , 2007, Pages 354-357

  La Spina, L ^a   Nanver, L K ^a   Schellevis, H ^a   Iborra, E ^b   Clement, M ^b   Olivares, J ^b  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

^b UNIVERSIDAD POLITÉCNICA DE MADRID   (Spain)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM COMPOUNDS; DIELECTRIC DEVICES; INTEGRATED CIRCUITS; PIEZOELECTRICITY; SILICON ON INSULATOR TECHNOLOGY;

ALUMINUM NITRIDE; HEAT SPREADING; MECHANICAL STRESS; TEST STRUCTURES;

PHYSICAL VAPOR DEPOSITION;

EID: 39549087879     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESSDERC.2007.4430951     Document Type: Conference Paper

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