Fabrication, assembly, and testing of Cu- and Al-based microchannel heat exchangers

Journal of Microelectromechanical Systems

Volumn 17, Issue 4, 2008, Pages 869-881

  Mei, Fanghua ^a   Parida, Pritish R ^a   Jiang, Jing ^a   Meng, Wen Jin ^a   Ekkad, Srinath V ^a  

^a LOUISIANA STATE UNIVERSITY   (United States)

Author keywords

Heat transfer characteristics; Metal based microchannel heat exchangers (MHEs); Molding replication

Indexed keywords

ALUMINUM; ASPECT RATIO; COPPER; COPPER ALLOYS; FORMING; HEAT TRANSFER; HEATING EQUIPMENT; METALS; MICROCHANNELS; MOLDING; OPTICAL DESIGN; RELIABILITY; SOLAR WATER HEATERS; SPECIFIC HEAT; THERMOANALYSIS;

AVERAGE RATE; ECONOMIC VIABILITY; EFFICIENT METHODS; EUTECTIC BONDING; HEAT TRANSFER CHARACTERISTICS; HEAT TRANSFER PERFORMANCE; HEAT TRANSFER RATES; HIGH ASPECT RATIOS; MECHANICAL INTEGRITY; METAL-BASED MICROCHANNEL HEAT EXCHANGERS (MHES); METALLIC MOLD; MICRO-CHANNEL DEVICES; MICROCHANNEL ARRAYS; MICROCHANNEL HEAT EXCHANGERS; MICROSCALE STRUCTURES; MOLDING REPLICATION; SURFACE PROFILING; WATER FLOWING; WIDE-RANGING APPLICATIONS;

HEAT EXCHANGERS;

EID: 49149131436     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2008.924276     Document Type: Article

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