Microscale compression molding of Al with surface engineered LiGA inserts

Microsystem Technologies

Volumn 10, Issue 8-9, 2004, Pages 662-670

  Cao, D M ^a   Meng, W J ^a  

^a LOUISIANA STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; ASPECT RATIO; COMPACTION; ELECTRODEPOSITION; FABRICATION; INJECTION MOLDING; NICKEL; SYNCHROTRON RADIATION;

HIGH ASPECT RATIO MICROSCALE STRUCTURES (HARMS); LITHOGRAPHIE, GALVANOFORMUNG, ABFORMUNG (LIGA); MICROSCALE COMPRESSION MOLDING; SURFACE QUALITY;

COMPRESSION MOLDING;

EID: 9944259014     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-004-0440-1     Document Type: Article

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