Evaluation of eutectic bond strength and assembly of Al-based microfluidic structures

Microsystem Technologies

Volumn 14, Issue 1, 2008, Pages 99-107

  Mei, Fanghua ^a   Jiang, J ^a   Meng, W J ^a  

^a Louisiana State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; ASPECT RATIO; EUTECTICS; MICROFLUIDICS; THIN FILMS;

BONDING PARAMETERS; BONDING TEMPERATURE; HIGH ASPECT RATIO MICROSCALE STRUCTURES (HARMS); INTERMEDIATE LAYERS;

BOND STRENGTH (MATERIALS);

EID: 34547829294     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-007-0407-0     Document Type: Article

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