Eutectic bonding of Al-based high aspect ratio microscale structures

Microsystem Technologies

Volumn 13, Issue 7, 2007, Pages 723-730

  Mei, Fanghua ^a   Jiang, J ^a   Meng, W J ^a  

^a Louisiana State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; ASPECT RATIO; COMPOSITE MATERIALS; ELECTRONICS PACKAGING; EUTECTICS; THIN FILMS;

EUTECTIC BONDING; HIGH-ASPECT-RATIO MICROSCALE STRUCTURES (HARMS);

MICROELECTROMECHANICAL DEVICES;

EID: 33847316131     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-006-0352-3     Document Type: Article

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