Replication of metal-based microscale structures

AIP Conference Proceedings

Volumn 879, Issue , 2007, Pages 1451-1455

  Jiang, J ^a   Meng, W J ^a   Sinclair, G B ^a   Stevens, C O ^b   Lara Curzio, E ^b  

^a Louisiana State University   (United States)

^b OAK RIDGE NATIONAL LABORATORY   (United States)

Author keywords

LiGA technology; Metal based HARMS; Microfabrication; Replication

Indexed keywords

EID: 33947374638     PISSN: 0094243X     EISSN: 15517616     Source Type: Conference Proceeding    
DOI: 10.1063/1.2436338     Document Type: Conference Paper

References (13)

1. F. Arias, S. R. J. Oliver, B. Xu, R. E. Homlin, G. M. Whitesides, Fabrication of metallic heat exchangers using sacrificial polymer mandrils, J. MEMS 10, 107 (2001).
2. C. Harris, K. Kelly, T. Wang, A. McCandless, S. Motakef, Fabrication, modeling, and testing of micro-cross-flow heat exchangers, JMEMS 11, 726 (2002).
3. J. D. Williams, W. Wang, Microfabrication of an electromagnetic power relay using SU-8 based UV-LIGA technology, Microsystem Technologies 10, 699 (2004).
4. M. Madou, Fundamentals of Microfabrication (CRC Press, Boca Raton, Florida, 2000).
5. D. M. Cao, D. Guidry, W. J. Meng, K. W. Kelly, Molding of Pb and Zn with microscale mold inserts, Microsystem Technologies 9, 559 (2003).
6. D. M. Cao, W. J. Meng, Microscale compression molding of Al with surface engineered LIGA inserts, Microsystem Technologies 10, 662 (2004).
7. D. M. Cao, J. Jiang, W. J. Meng, J. C. Jiang, W. Wang, Fabrication of high-aspect-ratio microscale Ta mold inserts with micro-electrical-discharge- machining, Microsystem Technologies, s00542-006-0198-8 (2006).
8. W. J. Meng, D. M. Cao, G. B. Sinclair, Stresses during micromolding of metals at elevated temperatures: pilot experiments and a simple model, J. Mater. Res. 20, 161 (2005).
9. D. M. Cao, J. Jiang, W. J. Meng, G. B. Sinclair, D. M. Cao, J. Jiang, W. J. Meng, G. B. Sinclair, Metal micromolding: further experiments and preliminary finite element analysis, Microsystem Technologies, s00542-006-0200-5 (2006).
10. J. D. Williams, W. Wang, Using magasonic development of SU-8 to yield ultra-high aspect ratio microstructures with UV lithography, Microsystem Technologies, 10, 694-698 (2004).
11. D. M. Cao, J. Jiang, R. Yang, W. J. Meng, Fabrication of high-aspect-ratio microscale mold inserts by parallel μEDM, Microsystem Technologies, s00542-006-0131-l (2006).
12. http://www.hightempmetals.com/techdata/hitempInconeIX750data.php (accessed May 18, 2006).
13. D. M. Cao, W. J. Meng, K. W. Kelly, High-temperature instrumented microscale compression molding of Pb, Microsystem Technologies 10, 323 (2004).