Experimental microchannel heat sink performance studies using nanofluids

International Journal of Thermal Sciences

Volumn 46, Issue 1, 2007, Pages 57-66

  Chein, Reiyu ^a   Chuang, Jason ^a  

^a NATIONAL CHUNG HSING UNIVERSITY   (Taiwan)

Author keywords

Microchannel heat sink (MCHS); Nanofluid; Particle volume fraction and particle agglomeration

Indexed keywords

COOLANTS; COPPER OXIDES; HEAT SINKS; HEAT TRANSFER; NANOSTRUCTURED MATERIALS; SILICON; TEMPERATURE DISTRIBUTION;

MICROCHANNEL HEAT SINK (MCHS); NANOFLUID; PARTICLE AGGLOMERATION; PARTICLE VOLUME FRACTION;

FLOW OF FLUIDS;

EID: 33750741974     PISSN: 12900729     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijthermalsci.2006.03.009     Document Type: Article

References (30)

1. Tuckerman D.B., and Pease R.F. High-performance heat sinking for VLSI. IEEE Electronic Devices Letters, EDL 2 (1981) 126-129
2. Wu H.Y., and Cheng P. An experimental study of convective heat transfer in silicon microchannels with different surface conditions. Int. J. Mass Heat Transfer 46 (2003) 2547-2556
3. Qu W., and Mudawar I. Experimental and numerical study of pressure drop and heat transfer in a single-phase micro-channel heat sink. Int. J. Heat Mass Transfer 45 (2002) 2549-2565
4. Knight R.W., Hall D.J., Goodling J.S., and Jaeger R.C. Heat sink optimization with application to microchannels. IEEE Transactions on Components, Hybrids, and Manufacturing Technology 15 (1992) 832-842
5. Horvat A., and Catton I. Numerical technique for modeling conjugate heat transfer in an electronic device heat sink. Int. J. Heat Mass Transfer 46 (2003) 2155-2168
6. K.V. Liu, S.U.S. Choi, K.E. Kasza, Measurements of pressure drop and heat transfer in turbulent pipe flows of particulate slurries, Report, Argonne National Laboratory, 1988, ANL-88-15
7. Webb R.L. Principles of Enhanced Heat Transfer (1993), John Wiley & Sons, New York
8. Wang X., Xu X., and Choi S.U.S. Thermal conductivity of nanoparticle-fluid mixture. J. Thermophys. Heat Transfer 13 (1999) 474-480
9. Lee S., Choi S.U.S., Li S., and Eastman J.A. Measuring thermal conductivity of fluids containing oxide nanoparticles. J. Heat Transfer 121 (1999) 280-289
10. Wang B.X., Zhou L.P., and Peng X.F. A fractal model for predicting the effective thermal conductivity of liquid with suspension of nanoparticles. Int. J. Heat Mass Transfer 46 (2003) 2665-2672
11. Koo J., and Kleinstreuer C. A new thermal conductivity model for nanofluids. J. Nanoparticle Research 6 (2004) 577-588
12. Xuan Y., and Roetzel W. Conceptions for heat transfer correlation of nanofluids. Int. J. Heat Mass Transfer 43 (2000) 3701-3707
13. Li Q., and Xuan Y. Convective heat transfer and flow characteristics of Cu-water nanofluid. Science in China, Series E 45 (2002) 408-416
14. Xuan Y., and Li Q. Investigation on convective heat transfer and flow features of nanofluids. ASME J. Heat Transfer 125 (2003) 151-155
15. Pak B.C., and Cho Y.L. Hydrodynamic and heat transfer study of dispersed fluids with submicron metallic oxide particles. Exp. Heat Transfer 11 (1998) 151-170
16. Yang Y., Zhang Z., Grulke E.A., and Anderson W.B. Heat transfer properties of nanoparticle-influid dispersions (nanofluids) in laminar flow. Int. J. Heat Mass Transfer 48 (2005) 1107-1116
17. Koo J., and Kleinstreuer C. Laminar nanofluid flow in microheat-sinks. Int. J. Heat Mass Transfer 48 (2005) 2652-2661
18. Chein R., and Hunag G. Analysis of microchannel heat sink performance using nanofluids. Applied Thermal Engineering 25 (2005) 3104-3114
19. Hamilton R.L., and Crosser O.K. Thermal conductivity of heterogeneous two-component systems. I and CE Fundamentals 1 (1962) 187-191
20. Khaled A.R.A., and Vafai K. Heat transfer enhancement through control of thermal dispersion effects. Int. J. Heat Mass Transfer 48 (2005) 2172-2185
21. Brinkman H.C. The viscosity of concentrated suspension and solutions. J. Chemistry Physics 20 (1952) 571-581
22. Tiselj I., Hetsroni G., Mavko B., Mosyak A., Pogrebnyak E., and Segal Z. Effect of axial conduction on the heat transfer in microchannels. Int. J. Heat Mass Transfer 47 (2004) 2551-2565
23. Lo C.H., Tsung T.T., Chen L.C., Su C.H., and Lin H.M. Fabrication of copper oxide nanofluid using submerged arc nanoparticle synthesis system (SANSS). J. Nanoparticle Res. 7 (2005) 313-320
24. Chang H., Jwo C.S., Lo C.H., Tsung T.T., Kao M.J., and Lin H.M. Rheology of CuO nanoparticle suspension prepared by ASNSS. Rev. Adv. Mater. Sci. 10 (2005) 128-132
25. Lo C.H., and Tsung T.T. Low-than-room temperature effect on the stability of CuO nanofluid. Rev. Adv. Mater. Sci. 10 (2005) 64-68
26. Wakeham W.A., Nagashime A., and Sengers J.V. Measurement of Transport Properties of Fluids (1991), Blackwell Scientific, Oxford, UK
27. Chen Y.Y., Yao Y.D., Lin B.T., Suo C.T., Shyu S.G., and Lin H.M. Specific heat of fine copper particles. Nanostructured Materials 6 (1995) 597-600
28. Israelachvili J. Intermolecular and Surface Forces (1992), Academic Press, New York
29. McNab G.S., and Meisen A. Thermophoresis in liquid. J. Colloid Interface Sci. 44 (1973) 339-346
30. Adomeit P., and Renz U. Deposition of fine particles from a turbulent liquid flow: experiments and numerical predictions. Int. J. Heat Mass Transfer 51 (1996) 3491-3503