Study of electromigration in eutectic snpb solder stripes using the edge displacement method

Journal of Electronic Materials

Volumn 35, Issue 8, 2006, Pages 1655-1659

  Chou, C K ^a   Hsu, Y C ^a   Chen, Chih ^a  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

Electromigration (EM); Flip chip solder; Packaging

Indexed keywords

ACTIVATION ENERGY; ATOMIC FORCE MICROSCOPY; CURRENT DENSITY; ELECTROMIGRATION; EUTECTICS; INTERMETALLICS; SOLDERED JOINTS; TIN COMPOUNDS;

DRIFT VELOCITY; EDGE DISPLACEMENT METHOD (EDM); FLIP CHIP SOLDERS; SOLDER STRIPES;

SOLDERING ALLOYS;

EID: 33748683361     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-006-0213-y     Document Type: Article

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