Growth kinetics of the intermetallics formed in diffusion soldered interconnections

Archives of Metallurgy and Materials

Volumn 51, Issue 3, 2006, Pages

  Wojewoda, J ^a   Zieba P ^a   Onderka, R ^a   Filipek, R ^b   Romanow P ^a  

^a INSTITUTE OF METALLURGY AND MATERIALS SCIENCE   (Poland)

^b AGH UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Poland)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 34248679034     PISSN: 17333490     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (22)

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