Phase characterization of diffusion soldered Ni/Al/Ni interconnections

Interface Science

Volumn 10, Issue 1, 2002, Pages 13-19

  Lopez G A ^a   Sommadossi, S ^a   Gust, W ^a   Mittemeijer, E J ^a   Zieba, P ^b  

^a UNIVERSITY OF STUTTGART   (Germany)

^b INSTITUTE OF METALLURGY AND MATERIALS SCIENCE   (Poland)

Author keywords

Diffusion soldering; Interface reactions; Intermetallic phases; Isothermal solidification; Ni Al system

Indexed keywords

BONDING; GROWTH (MATERIALS); INTERDIFFUSION (SOLIDS); PHASE COMPOSITION; PHASE INTERFACES; PROBES; SCANNING ELECTRON MICROSCOPY; SOLDERING; SOLIDIFICATION; TEMPERATURE; X RAY DIFFRACTION ANALYSIS;

DIFFUSION SOLDERING; ELECTRON PROBE MICROANALYSIS; INTERFACE REACTIONS; ISOTHERMAL SOLIDIFICATION;

INTERMETALLICS;

EID: 0036541196     PISSN: 09277056     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1015172710411     Document Type: Article

References (12)

1. Pearson's handbook-desk edition