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Volumn 93, Issue 6, 2002, Pages 496-501

Mechanical properties of Cu/In-48 Sn/Cu diffusion-soldered joints

Author keywords

Diffusion soldering; Hardness; Interconnections; Intermetallics in the Cu In Sn system; Shear strength; Tensile strength

Indexed keywords

DIFFUSION; HARDNESS; HARDNESS TESTING; INDIUM ALLOYS; MORPHOLOGY; SHEAR STRENGTH; SOLDERED JOINTS; SURFACES; TENSILE STRENGTH; TENSILE TESTING; TIN ALLOYS;

EID: 0036610733     PISSN: 00443093     EISSN: None     Source Type: Journal    
DOI: 10.3139/146.020496     Document Type: Article
Times cited : (13)

References (19)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.