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Volumn 2005, Issue , 2005, Pages 2030-2035

Power conversion with SiC devices at extremely high ambient temperatures

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC INDUCTORS; ELECTRONICS PACKAGING; JUNCTION GATE FIELD EFFECT TRANSISTORS; SCHOTTKY BARRIER DIODES; SILICON CARBIDE; THERMAL EFFECTS;

EID: 33847766468     PISSN: 02759306     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/PESC.2005.1581911     Document Type: Conference Paper
Times cited : (13)

References (10)
  • 2
    • 33749527661 scopus 로고    scopus 로고
    • Modeling and Simulation of Wide Bandgap Semiconductor Devices: 4H/6H-SiC
    • Shaker Verlag, Aachen
    • M. Lades, "Modeling and Simulation of Wide Bandgap Semiconductor Devices: 4H/6H-SiC," Selected Topics of Electronics and Micromechatronics, Vol. 3, Shaker Verlag, Aachen 2002.
    • (2002) Selected Topics of Electronics and Micromechatronics , vol.3
    • Lades, M.1
  • 6
    • 10944244716 scopus 로고    scopus 로고
    • High Temperature Design and Testing of a DC-DC Power Converter with Si and SiC Devices
    • 33p5, Seattle, October 3-7
    • B. Ray, R. L.Spyker, "High Temperature Design and Testing of a DC-DC Power Converter with Si and SiC Devices," 39th IEEE Industry Applications Society Annual Meeting, 33p5, Seattle, October 3-7, 2004.
    • (2004) 39th IEEE Industry Applications Society Annual Meeting
    • Ray, B.1    Spyker, R.L.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.