Evaluation of substrate technologies under high temperature cycling

2006 4th International Conference on Integrated Power Systems, CIPS 2006

Volumn , Issue , 2006, Pages

  Dupont, Laurent ^a   Lefebvre, Stéphane ^a   Khatir, Zoubir ^b   Bontemps, Serge ^c  

^a Centre National de la Recherche Scientifique   (France)

^b UNIVERSITÉ GUSTAVE EIFFEL   (France)

^c APT Europe ^*  (France)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS;

CERAMIC SUBSTRATES; DIFFERENT STRUCTURE; HARSH ENVIRONMENT; HIGH TEMPERATURE; HIGH TEMPERATURE CYCLING; METALLIZATION THICKNESS; POWER MODULE; SUBSTRATE TECHNOLOGY;

SUBSTRATES;

EID: 84971413291     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. L. Dupont, et al., "Electrical Characterizations and evaluation of thermo-mechanical stresses of a power module dedicated to high temperature applications", EPE 2005, Sept. 2005, Dresden, Germany.
2. J. Schulz-Harder, "Advantages and New Development of direct Bonded Copper Substrates", Microelectronics Reliability, 2003, Vol. 43, p.359-365.
3. G. Mitic, R. Beinert, et al., "Reliability of AlN Substrates and their Solder Joints in IGBT Power Modules", Microelectronics Reliability, 1999, Vol. 39, p.1l59-l164.
4. Y. Nagatomo and T. Nagase, "The Study of the Power Modules with High Reliability for EV Use", 17th EV S conf., Montreal, October 2000.
5. K.H. Dalal, et al., "Design trade-offs and reliability of power circuit substrates with respect to varying geometrical parameters of direct copper bonded Al203 and BeO", Industry Applications Conference, Thirtieth lA S Annual Meeting, Conference Record of the 1995 IEEE Volume 1, Oct. 1995, p.923 - 929.
6. J. Yamada, et at., "The Latest High Performance and High Reliability IGBT Technology in New Packages with Conventional Pin Layout", PCIM 2003, May 2003, Niimberg, Germany.
7. KYOCERA, "Kyocera Power Module Substrate, Si3N4 AMB Substrate", AMB ver.6.l, 2004.