Lead free die mount adhesive using silver nanoparticles applied to power discrete package

Advancing Microelectronics

Volumn 32, Issue 5, 2005, Pages 8-11

  Ukita, Yasunari ^a   Tateyama, Kazuki ^a   Segawa, Masao ^a   Tojo, Yoshihiko ^a   Gotoh, Hideyuki ^b   Oosako, Katsuhisa ^b  

^a TOSHIBA CORPORATION   (Japan)

^b Harima Chemicals Inc   (Japan)

Author keywords

Die mount; Discrete package; Lead free; Metal nanoparticle; Silver paste; Thermal conductivity

Indexed keywords

DIE MOUNT; DISCRETE PACKAGE; LEAD-FREE; METAL NANOPARTICLE; SILVER PASTE;

DIES; LEAD; NANOSTRUCTURED MATERIALS; SILVER; SOLDERING; THERMAL CONDUCTIVITY; TRANSISTORS;

ADHESIVES;

EID: 27344443287     PISSN: None     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (5)

1. Y.Matusba, "Direct patterning using metal nano-particles," Journal of Japan Institute of Electronics Packaging,Vol.6, No.2 (2003)
2. T.Honda, Convertech,Vol.6 (2002)
3. T.Honda,"Improvement of printability for highly conductive and lower temperature curable conductive paste materials,"The 17th JIEP Annual Meeting (2003)
4. H. Gotoh,"Microprocessing and joining in the fields of electronics production," Symposium of the High Temperature Society of Japan (2002)
5. M.Oda, "Metal Nano-Particles,"Journal of Japan Institute of Electronics Packaging,Vol.5, No.6 (2002)