Packaging materials and approaches for high temperature SiC power devices

Advancing Microelectronics

Volumn 31, Issue 1, 2004, Pages 8-11

  Johnson, R Wayne ^a   Palmer, Michael ^a   Wang, Cai ^a   Liu, Yi ^a  

^a AUBURN UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM NITRIDE; ELECTRIC CONDUCTIVITY; EUTECTICS; MELTING; METALLIZING; OXIDATION; PACKAGING MATERIALS; PLATINUM; SILICON CARBIDE; STRENGTH OF MATERIALS; THERMAL CYCLING; THERMAL EXPANSION;

COEFFICIENT OF THERMAL EXPANSION (CTE); POWER DEVICES; THERMAL PERFORMANCE;

ELECTRONICS PACKAGING;

EID: 25144497105     PISSN: None     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Conference Paper

References (8)

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2. J. B. Casady, W. C. Dillard, R.W. Johnson, and U. Rao,"A Hybrid, 6H-SiC Temperature Sensor Operational from 25°C to 500°C," The IEEE Transactions on Components, Packaging and Manufacturing Technology - Part A, Vol. 19, No. 3, September 1996, pp. 416-422.
3. Jay S. Salmon, R. Wayne Johnson, and Mike Palmer, "Thick Film Hybrid Packaging Techniques for 500°C Operation," Proceedings of the 4th International High Temperature Electronics Conference, Albuquerque, NM, June 16-19, 1998, pp. 103-108.
4. Philip W. Lees, "Development and Application of Connector Contact Material Systems for Elevated Temperature Applications," SMTA/CAVE Harsh Environment Workshop, Dearborn, MI, June 24-25, 2003.
5. Liang-Yu Chen and Philip G. Neudeck "Thick and Thin Film Materials Based Chip Level Packaging for High Temperature SiC Sensors and Devices," Proceedings of the 5th International 2000 High Temperature Electronics Conference,Albuquerque, NM, June 12-15, 2000.
6. R.W. Chuang and C. C. Lee,"Silver-Indium Joints Produced at Low Temperature for High Temperature Devices," IEEE Transactions on Components and Packaging Technology,Vol. 25, No. 3, Sept. 2002 pp. 453-458.
7. Shun-Tien Lin, and Liang-Yu Chen, "Thermo-Mechanical Optimization of a Gold Thick-film based SiC Die-attach Assembly using Finite Element Analysis," Proceedings of the 6th International High Temperature Electronics Conference,Albuquerque, NM, June 2-5, 2002.
8. Jeffrey E. Naefe, R. Wayne Johnson, and Richard R. Grzybowski,"High- Temperature Storage and Thermal Cycling Studies of Heraeus-Cermalloy Thick Film and Dale Power Wirewound Resistors," IEEE Transactions on Components and Packaging Technology,Vol. 25, No. 1, March 2002, pp. 45-52.