High temperature considerations in SiC power converter design - Package design and results

Proceedings - 2006 IMAPS International Conference and Exhibition on High Temperature Electronics, HiTEC 2006

Volumn , Issue , 2006, Pages 108-117

  Casey, Leo ^a   Davis, Gregg ^a   Borowy, Bogdan ^a   Connell, Jim ^b  

^a Satcon Technology Corporation   (United States)

^b Advanced Thermal Technology   (United States)

Author keywords

Conductivity; Flipchip; High temperature; Matched expansion alloys; Power package; Wire bonds

Indexed keywords

EXPANSION ALLOYS; FLIP CHIP; HIGH TEMPERATURE; POWER PACKAGE; WIRE BONDS;

ELECTRIC CONDUCTIVITY; INTERFACES (MATERIALS); PACKAGING MATERIALS; POWER ELECTRONICS; SEMICONDUCTOR DEVICE MANUFACTURE; SILICON CARBIDE;

DESIGN;

EID: 65949089102     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

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