Thermomigration in SnPb composite solder joints and wires

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 1974-1978

  Ouyang, Fan Yi ^a   Huang, Annie T ^a   Tu, K N ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITE WIRES; COMPOSITION REDISTRIBUTION; THERMOMIGRATION; THRESHOLD TEMPERATURE GRADIENT;

ANTIMONY COMPOUNDS; EUTECTICS; FLIP CHIP DEVICES; SUBSTRATES; WIRE;

SOLDERED JOINTS;

EID: 33845598573     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645931     Document Type: Conference Paper

References (3)

1. H. Ye, C. Basaran, and D. C. Hopkins, "Thermomigration in Pb-Sn solder joints under joule heating during electric current stressing," Appl. Phys. Lett., 82, 1045-1047 (2003)
2. C. Basaran, H. Ye, D. C. Hopkins, D. R. Frear and J. K. Lin, "Failure modes of flip chip solder joints under high electric current density," J. of Electronic Packaging, vol. 127 of Transaction of the ASME, 157-163 (2005)
3. A. T. Huang, A. M. Gusak, and K. N. Tu, Appl. Phys. Lett., In press (2006)