Electromigration of copper in Al(0.25 at.% Cu) conductor lines

Journal of Applied Physics

Volumn 89, Issue 5, 2001, Pages 2588-2597

  Kao, H K ^a,c   Cargill III, G S ^a   Hu, C K ^b  

^a Lehigh University   (United States)

^b IBM T J WATSON RESEARCH CENTER   (United States)

^c INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0001167701     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1344917     Document Type: Article

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