Thermosonic Gold Wirebonding to Electrolessly-Metallized Copper Bondpads over Benzocyclobutene

International Journal of Microcircuits and Electronic Packaging

Volumn 22, Issue 3, 1999, Pages 190-195

  Ulrich, Richard ^a   Wasef, Mohammed ^a   Im, Jang Hi ^b   Garrou, Phil ^c   Scheck, Dan ^c  

^a UNIVERSITY OF ARKANSAS   (United States)

^b DOW CHEMICAL COMPANY   (United States)

^c MCNC   (United States)

Author keywords

BCB; Benzocyclobutene; Bond Pad; CYCLOTENE ; Electroless Plating; Polymer Dielectric; Wirebonding

Indexed keywords

EID: 0001231450     PISSN: 10631674     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (15)

1. "The National Technology Roadmap for Semiconductors", SIA, San Jose, California, pg. 63, 1997.
2. S. P. Murarka and S. W. Hymes. "Copper Metallization for ULSI and Beyond." Critical Reviews in Solid and Material Sciences, Vol. 20, No. 2, pg. 87, 1995.
3. G. Harman, "Wirebonding in Microelectronics Materials, Processes, Reliability, and Yield", Second Edition, McGraw-Hill, New York, 1997.
4. G. Harman. "Wirebonding to Multichip Modules and Other Soft Substrates." Proceedings of the International Conference on Multichip Modules, MCM '95, Denver, Colorado, pg. 295, 1995.
5. J. Strandberg , H. Theide, A. Karlsson, and A. Weiland, "A High Reliability 4-Metal Layer MCM-D Structurewith BCB as Dielectric", Proceedings of the International Conference on Multichip Modules, MCM '95, Denver, Colorado, pg. 223, 1995.
6. D. E. Chung et al. "The Optimization of Wirebond Conditions to Minimize the Deformation of BCB on MCM-D multilayer Substrates", Proceedings of the Fourth International Symposium on Microelectronic Packaging, IMAPS, Seoul, Korea, pg. 101, 1998.
7. Details of this amino-silane adhesion promoter are given on the Cyclotene web page www.cyclotene.com.
8. M. Antler, "Gold-Plated Contacts: Effect of Heating on Reliability", Plating, pg. 615, June 1970.
9. M. P. Skinner, D. Castillo, S. Cummings, P. E. Garrou, K. Liu, D. Chazan, R. Reinschmidt, S. Westbrook, C. Ho, and W. B. Rogers, "Twin Star - Dual Pentium Processor Module", International Journal Microcircuits and Electronic Packaging, IJMEP, Vol. 19, pg. 358, 1996.
10. G. Czornyj, M. Asano, R. Beliveau, P. Garrou, H. Hiramoto, A. Ikeda, J. Kreuz, and O. Rhode, "Polymers in Packaging", Chapter 11 in Microelectronic Packaging Handbook: Part II Semiconductor Packaging, R. Tummala, G. Rymaszewski and A. Klopfenstein Eds., Chapman Hall, New York, 1997.
11. P. E. Garrou, "MCM-D: Thin Film Materials, Processes and Applications", Chapter 3 in Multichip Module Handbook, P. Garrou & I. Turlik, Eds., McGraw-Hill, New York, 1997.
12. P. E. Garrou, "Polymer Dielectrics for Multichip Module Packaging", Proceedings of IEEE, Vol. 80, pg. 1992, 1992.
13. J. Im et al., "On the Mechanical Reliability of Photo BCB Based Thin Film Dielectric Polymer for Electronic Packaging Applications", Proceedings of Workshop on Mechanical Reliability of Polymeric Materials and Plastic Packages of IC Devices, Paris, pg. 191, 1998.
14. J. Im, E. O. Shaffer, R. Peters, T. Rey, C. Murlick, and R. L. Sammler, "Physical and Mechanical Properties Determination of Photo BCB based Thin Films", Proceedings of the International Symposium on Microelectronics, ISHM '96, Minneapolis, Minnesota, pp. 168-175, 1996.
15. A. Strandjord, Y. Ida, B. Rogers, P. Garrou, S. Cummings, and S. Kisting, "MCM-D Fabrication with Photosensitive Benzocyclobutene", International Journal ofMicrocircuits and Electronic Packaging, IJMEP, Vol. 19, pg. 260, 1996.