Thermal and mechanical stability of electrically conductive adhesive joints

Journal of Electronic Materials

Volumn 34, Issue 5, 2005, Pages 625-629

  Xiao, Jun ^a,b   Chung, D D L ^a  

^a UNIVERSITY AT BUFFALO   (United States)

^b NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS   (China)

Author keywords

Conductive adhesive; Electrical resistivity; Epoxy; Silicone; Silver

Indexed keywords

ADHESIVES; COMPACTION; ELECTRIC CONDUCTIVITY; EPOXY RESINS; HEAT RESISTANCE; SILICONES; SILVER; STABILITY; THERMAL EFFECTS;

ALLEVIATION; CONDUCTIVE ADHESIVES; EPOXY; OZONE LAYER DEPLETION;

ADHESIVE JOINTS;

EID: 20344384265     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-005-0075-8     Document Type: Conference Paper

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