Z-axis interconnection for enhanced wiring in organic laminate electronic packages

Proceedings - Electronic Components and Technology Conference

Volumn 2, Issue , 2005, Pages 1132-1138

  Egitto, F D ^a   Krasniak, S R ^a   Blackwell, K J ^a   Rosser, S G ^a  

^a Endicott Interconnect Technologies Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITE STRUCTURES; DATA COMMUNICATION SYSTEMS; ELECTRIC CONDUCTANCE; ELECTRIC WIRING; FLIP CHIP DEVICES; LAMINATES; NETWORKS (CIRCUITS);

DATA RATES; LAMINATION; WIRING CHANNELS; WIRING DENSITY;

ELECTRONICS PACKAGING;

EID: 24644446471     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. Alcoe, D., Blackwell, K., Youngs, T., "Qualification Results of HyperBGA, IBM's High Performance Flip Chip Organic BGA Chip Carrier," Semicon West Conference, San Jose, CA, July 2000.
2. McBride, R., Rosser, S.G., and R.P. Nowak, "Modeling and Simulation of 12.5 Gb/s on a HyperBGA Package," IEEE / CPMT / SEMI Int'l Electronics Manufacturing Technology Symposium, 2003.
3. Budell, T., Audet, J., Kent, D, Libous, J., O'Connor, D., Rosser, S.G., and Tremble, E., "Comparison of Multilayer Organic and Ceramic Package Simultaneous Switching Noise Measurements using a 0.16 urn CMOS Test Chip," ECTC 2001.