Research trends in lead-free soldering in the US: NCMS Lead-Free Solder Project

Proceedings - 1st International Symposium on Environmentally Conscious Design and Inverse Manufacturing, EcoDesign 1999

Volumn , Issue , 1999, Pages 602-605

  Artaki, I ^a   Noctor, D ^a   Mather, J ^b   Schroeder, S ^b   Napp, D ^c   Desantis, C ^d   Desaulnier, W ^d   Pan, Tsung Yu ^e   Felton, L ^f   Palmer, M ^f   Rosser, J ^g   Felty, J ^h   Vianco, P ⁱ   Greaves, J ^j   Whitten, G ^k   Zhu, Yun ^k   Handwerker, C ^l  

^a NOKIA RESEARCH CENTER   (United States)

^b Rockwell International   (United States)

^c Hamilton Standard ^*  (United States)

^d Hamilton Standard   (United States)

^e FORD MOTOR COMPANY   (United States)

^f RENSSELAER POLYTECHNIC INSTITUTE   (United States)

^g Hughes Missile Systems Company   (United States)

^h TEXAS INSTRUMENTS   (United States)

ⁱ SANDIA NATIONAL LABORATORIES   (United States)

^j EMPF   (United States)

^k DELPHI CORPORATION   (United States)

^l NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

more..

Author keywords

[No Author keywords available]

Indexed keywords

COST EFFECTIVENESS; INDIUM PLATING; KNOWLEDGE BASED SYSTEMS; LEAD; MANUFACTURE; MECHANICAL VARIABLES MEASUREMENT; SOLDERING; SOLDERING ALLOYS;

ACADEMIC INSTITUTIONS; ELECTRONIC PRODUCT; ELECTRONICS MANUFACTURING; LEAD-FREE SOLDERING; MANUFACTURING PROCESSES AND EQUIPMENT; NATIONAL LABORATORY; PLATED THROUGH HOLE; TOXICOLOGICAL EFFECTS;

INDUSTRIAL RESEARCH;

EID: 84889432652     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECODIM.1999.747683     Document Type: Conference Paper

References (1)

1. NCMS Lead-Free Solder Project Final report, NCMS, Ann Arbor, MI, August, 1997.