Influence of nanoparticles, Low Melting Point (LMP) fillers, and conducting polymers on electrical, mechanical, and reliability performance of micro-filled conducting adhesives for Z-axis interconnections

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 74-81

  Das, Rabindra N ^a   Papathomas, Konstantinos I ^a   Lauffer, John M ^a   Egitto, Frank D ^a  

^a Endicott Interconnect Technologies Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; EPOXY RESINS; FILLERS; MELTING POINT; OPTICAL INTERCONNECTS; PARTICLE SIZE;

ELECTRICAL INTERCONNECTIONS; MICRO-FILLED ADHESIVES; PRINTED WIRING BOARD (PWB);

NANOPARTICLES;

EID: 35348882067     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373779     Document Type: Conference Paper

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