Low-stress fabrication of 3D polymer free standing structures using lamination of photosensitive films

Microsystem Technologies

Volumn 14, Issue 8, 2008, Pages 1205-1214

  Abgrall, Patrick ^a,b   Charlot, Samuel ^a   Fulcrand, Remy ^a   Paul, Lefillastre ^a   Boukabache, Ali ^a   Gué, Anne Marie ^a  

^a UNIVERSITÉ DE TOULOUSE   (France)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

AEROSPACE APPLICATIONS; CHEMICALS; COMPOSITE MICROMECHANICS; COMPUTER NETWORKS; CURVE FITTING; DETECTORS; ELECTRIC NETWORK PARAMETERS; ELECTROCHEMICAL SENSORS; ELECTRONICS INDUSTRY; EMULSIFICATION; FLUIDIC LOGIC DEVICES; FLUIDICS; INTEGRATED CIRCUITS; LAMINATING; LIGHT SENSITIVE MATERIALS; LITHOGRAPHY; MEMS; METROPOLITAN AREA NETWORKS; MICROELECTROMECHANICAL DEVICES; MICROELECTRONICS; MICROFLUIDICS; MOLECULAR BEAM EPITAXY; NANOFLUIDICS; NETWORK PROTOCOLS; NONMETALS; OPTICAL PROPERTIES; PAINTING; PHOTOSENSITIVITY; POLYMER FILMS; POLYMERS; SENSOR NETWORKS; SENSORS; SILICON; STRESSES; SUBSTRATES; TECHNOLOGY;

(100) SILICON; (ABIOTIC AND BIOTIC) STRESS; (PL) PROPERTIES; BONDING PROCESSES; BUILDING BLOCKS; CURVATURE (SORI); FABRICATION PROCESSES; FREE STANDING STRUCTURES; HYBRID INTEGRATION; LAMINATION PROCESS; LOW PRESSURE (LP); LOW TEMPERATURE PROCESSING; MICRO FLUIDIC; MICRO FLUIDIC SYSTEMS; NANOTECHNOLOGIES; ON-CHIPS; PARAMETRIC OPTIMIZATIONS; PHOTOSENSITIVE FILMS; PLANARIZING; RELEASE LAYER; RIGID SUBSTRATES; SILICON CHIPS; SPRINGER (CO); SYSTEM INTEGRATION (SI); THREE-DIMENSIONAL (3-D) FABRICATION;

PHOTORESISTS;

EID: 45949102675     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-008-0625-0     Document Type: Article

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