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Volumn 1, Issue 1, 2001, Pages 29-34

Polyimide-based microfluidic devices

Author keywords

[No Author keywords available]

Indexed keywords

POLYIMIDE;

EID: 0002429667     PISSN: 14730197     EISSN: None     Source Type: Journal    
DOI: 10.1039/b103896f     Document Type: Article
Times cited : (171)

References (25)
  • 11
    • 0029451937 scopus 로고    scopus 로고
    • Rio . de Janeiro, Brazil
    • A. B. Frazier, 38th Midwest Symposium on Circuits and Systems, Rio . de Janeiro, Brazil, 1996, pp. 505-8.* The paper outlines a wafer-to wafer bonding technique with embedded microchannels, which uses polyimide as adhesive.
    • (1996) 38th Midwest Symposium on Circuits and Systems , pp. 505-508
    • Frazier, A.B.1
  • 14
    • 0033474579 scopus 로고    scopus 로고
    • I. K. Glasgow, D. J. Beebe and V. E. White, Sensors-and-Materials, 1999, 11, 269.** This paper describes a solvent bonding technique where microfluidic devices are fabricated between two wafers. Open channels are patterned on a first wafer, a second wafer is spin-coated with polyimide precursor and the two wafers are put in contact and bonded together in a vacuum oven.
    • (1999) Sensors-and-Materials , vol.11 , pp. 269
    • Glasgow, I.K.1    Beebe, D.J.2    White, V.E.3
  • 21
    • 0024089116 scopus 로고
    • H. R. Brown, A. C. M. Yang, T. P. Russell, W. Volksen and E. J. Kramer, Polymer, 1988, 29, 1807.* This paper illustrates the importance of cure cycle adaptation between polyimide layers to improve adhesion. Good adhesion results from a low cure temperature of the first layer followed by a higher cure temperature of the final layer sandwich.
    • (1988) Polymer , vol.29 , pp. 1807
    • Brown, H.R.1    Yang, A.C.M.2    Russell, T.P.3    Volksen, W.4    Kramer, E.J.5
  • 22
    • 0024683176 scopus 로고
    • K. L. Saenger, H. M. Tong and R. D. Haynes, J. Polym. Sci., Part C: Polym. Lett., 1989, 27, 235.* This paper outlines the influence of swelling agent treatment of polyimide layers before lamination. Adhesion strengthening can be fostered by the sorption of a strong solvent.
    • (1989) J. Polym. Sci., Part C: Polym. Lett. , vol.27 , pp. 235
    • Saenger, K.L.1    Tong, H.M.2    Haynes, R.D.3
  • 23
    • 0030144449 scopus 로고    scopus 로고
    • N. C. Stoffel, M. Hsieh, E. J. Kramer and W. Volksen, IEEE Trans. Compon., Packag., Manuf. Technol., Part B:, 1996, 19, 417.** The paper reports on the formation of strong polyimide laminates by modifying the surface of a Kapton™ base film, causing the region within 200 nm of the surface to reconvert to polyamic acid (polyimide precursor). A layer in contact with this modified film will result in a diffuse interface between the base film and the laminated film leading to high bond strengths after the cure.
    • (1996) IEEE Trans. Compon., Packag., Manuf. Technol., Part B , vol.19 , pp. 417
    • Stoffel, N.C.1    Hsieh, M.2    Kramer, E.J.3    Volksen, W.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.