Novel test methods for die strength

Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005

Volumn PART B, Issue , 2005, Pages 939-945

  Tsai, M Y ^a   Chen, C H ^a   Lin, C S ^a  

^a CHANG GUNG UNIVERSITY   (Taiwan)

Author keywords

Die strength; Electronic packaging; Failure mode; Four point bending; Point loading; Test method; Wafer thinning

Indexed keywords

ATOMIC FORCE MICROSCOPY; BENDING (DEFORMATION); FAILURE ANALYSIS; FINITE ELEMENT METHOD; INTEGRATED CIRCUITS; SILICON WAFERS; STRESS ANALYSIS;

DIE STRENGTH; FAILURE MODE; FOUR-POINT BENDING; POINT LOADING; TEST METHOD; WAFER THINNING;

ELECTRONICS PACKAGING;

EID: 32844468193     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ipack2005-73296     Document Type: Conference Paper

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