On the degradation of the solder joints of underfilled flip chip packages: A case study

Soldering and Surface Mount Technology

Volumn 12, Issue 3, 2000, Pages 24-28

  Qun, Zhang ^a   Xiaoming, Xie ^a   Liu, Chen ^a   Guozhong, Wang ^a   Zhaonian, Cheng ^a   Kempe, Wolfgang ^b  

^a DaimlerChrysler SIM Technology Co Ltd   (China)

^b DAIMLER AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK PROPAGATION; DELAMINATION; ELECTRONICS PACKAGING; ENCAPSULATION; FLIP CHIP DEVICES; METALLOGRAPHY; MICROPROCESSOR CHIPS; SOLDERED JOINTS;

UNDERFILLED FLIP CHIP PACKAGES;

SURFACE MOUNT TECHNOLOGY;

EID: 0342521379     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910010347863     Document Type: Article

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