Evaluation of interfacial fracture toughness of a flip-chip package and a bimaterial system by a combined experimental and numerical method

Engineering Fracture Mechanics

Volumn 64, Issue 6, 1999, Pages 781-797

  Wang, Jianjun ^a   Zou, Daqing ^a   Lu, Minfu ^a   Ren, Wei ^a   Liu, Sheng ^a  

^a Wayne State University   (United States)

Author keywords

Energy release rate; Finite element analysis; Interfacial fracture toughness; Moir interferometry; Phase angle

Indexed keywords

CRACK PROPAGATION; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; FRACTURE TOUGHNESS; INTERFEROMETRY; LASERS; MATERIALS TESTING; THERMAL LOAD;

HIGH DENSITY LASER MOIRE INTERFEROMETRY; INTERFACIAL FRACTURE TOUGHNESS;

FLIP CHIP DEVICES;

EID: 0033309103     PISSN: 00137944     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0013-7944(99)00078-8     Document Type: Article

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