Thermo-mechanical behavior and microstructural evolution of electrochemically deposited low-alloyed Cu(Ag) thin films

Microelectronic Engineering

Volumn 76, Issue 1-4, 2004, Pages 205-211

  Strahle, S ^a   Menzel, S ^a   Wendrock, H ^a   Acker, J ^a   Gemming, T ^a   Wetzig, K ^a  

^a IFW DRESDEN   (Germany)

Author keywords

CuAg thin films; Microstructure; Thermal cycling; Thin film stress

Indexed keywords

ELECTROCHEMISTRY; ELECTRODEPOSITION; MICROSTRUCTURE; THERMAL CYCLING; THERMAL STRESS; THIN FILMS;

CUAG THIN FILMS; MICROSTRUCTURAL EVOLUTION; THIN FILM STRESSES;

MICROELECTRONICS;

EID: 4544366099     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2004.07.055     Document Type: Conference Paper

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