Thickness effect on grain growth and precipitate coarsening of a copper-silver thin film in an advanced metallization process

Journal of Materials Science: Materials in Electronics

Volumn 14, Issue 2, 2003, Pages 103-108

  Ko, Y K ^a   Jang, J H ^a   Lee, S ^a   Yang, H J ^a   Lee, W H ^a   Lee, J G ^a   Reucroft, P J ^b  

^a Kookmin University   (South Korea)

^b UNIVERSITY OF KENTUCKY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; DIFFUSION IN SOLIDS; ELECTRIC CONDUCTIVITY; GRAIN BOUNDARIES; GRAIN GROWTH; GRAIN SIZE AND SHAPE; METALLIZING; PHASE TRANSITIONS; PRECIPITATION (CHEMICAL); THERMAL CONDUCTIVITY; THICKNESS MEASUREMENT; VOLUME FRACTION;

ADVANCED METALLIZATION PROCESS; PARTICLE PINNING PRESSURE; PRECIPITATE COARSENING; THICKNESS EFFECT;

COPPER ALLOYS;

EID: 0037298090     PISSN: 09574522     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1021956703967     Document Type: Article

References (20)

1. S. P. MURARKA, R. J. GUTMANN, A. E. KALOYEROS and W. A. LANFORD, Thin Solid Films 236 (1993) 257.
2. A. JIAN, T. T. KODAS, R. JAIRATH and M. J. HAMPDEN-SMITH, J. Vac. Sci. Technol. B 11 (1993) 2107.
3. S. P. MURARKA and S. W. HYMES, Solid State Mater. Sci. 20 (1995) 87.
4. Y. J. PARK, V. K. ANDLEIGH and C. V. THOMPSON, J. Appl. Phys. 85 (1999) 3546.
5. R. LIU, C. S. PAI and E. MARTINEZ, Solid State Electron. 43 (1999) 1003.
6. X. W. LIN and D. PRAMANLK, Solid State Technol. 41 (1998) 63.
7. P. J. DING, W. WANG, W. A. LANFORD, S. HYMES and S. P. MURARKA, Appl. Phys. Lett. 65 (1994) 1778.
8. H. ITO, Y. NAKASAKI, G. MINAMIHABA, K. SUGURO and H. OKANO, ibid, 63 (1993) 934.
9. J. LI, J. W. MAYER and E. G. COLOGAN, J. Appl. Phys. 70 (1991) 2820.
10. W. H. LEE, H. Y. CHO, B. S. CHO, J. Y. KIM, Y.-S. KIM, W.-G. JUNG, H. KWON, J. H. LEE, C. M. LEE, P. J. REUCROFT and J. G. LEE, J. Vac. Sci. Technol. A 18 (2000) 2972.
11. W. H. LEE, H. Y. CHO, B. S. CHO, J.Y. KIM, Y.-S. KIM, W.-G. JUNG, H. KWON, J. H. LEE, C. M. LEE, P. J. REUCROFT and J. G. LEE, J. Electrochem. Soc. 147 (2000) 3066.
12. W. H. LEE, H. Y. CHO, B. S. CHO, J. Y. KIM, Y.-S. KIM, W.-G. JUNG, H. KWON, J. H. LEE, C. M. LEE, P. J. REUCROFT, E. G. LEE and J. G. LEE, Appl. Phys. Lett. 77 (2000) 2192.
13. J. M. E. HARPER and K. P. RODBELL, J. Vac. Sci. Technol. B 15(4) (1997) 763.
14. J. M. E. HARPER, C. CABRAL, Jr., P. C. ANDRICACOS, L. GIGNAC, I. C. NOYAN, K. P. RODBELL and C. K. HU, J. Appl. Phys. 86 (1999) 2516.
15. C. V. THOMPSON and R. CAREL, Mater. Sci. Eng. B 32 (1995) 211.
16. S. VAIDYA and A. K. SINHA, Thin Solid Films 75 (1981) 253.
17. D. B. KNORR, D. P. TRACY and K. R. RODBELL, Appl. Phys. Lett. 59 (1991) 3241.
18. D. B. KNORR and K. P. RODBELL, J. Appl. Phys. 79 (1996) 2409.
19. R. E. REED-HILL and R. ABRASCHIAN, in "Physical Metallurgy Principles," 3rd edn (PWS Publishing Company, Boston, 1994) p. 259.
20. D. A. PORTER and K. E. EASTERLING, in "Phase Transformation in Metals and Alloys," 2nd edn. (Chapman & Hall, London, 1993) p. 315.