Electrodeposition of copper-tin alloy thin films for microelectronic applications

Electrochimica Acta

Volumn 48, Issue 8, 2003, Pages 935-943

  Padhi, Deenesh ^a   Gandikota, Srinivas ^a   Nguyen, Hoa B ^a   McGuirk, Chris ^a   Ramanathan, Sivakami ^a   Yahalom, Joseph ^a,b   Dixit, Girish ^a  

^a APPLIED MATERIALS INC   (United States)

^b TECHNION ISRAEL INSTITUTE OF TECHNOLOGY   (Israel)

Author keywords

Alloy deposition under mass transfer control; Alloy thin film co deposition; Copper tin alloy electrodeposition; Electromigration in interconnects; Under potential deposition

Indexed keywords

COMPOSITION; COPPER ALLOYS; CURRENT DENSITY; ELECTRODEPOSITION; ELECTROLYTES; ELECTROMIGRATION; MICROELECTRONICS; THIN FILMS;

ALLOY THIN FILMS;

METALLIC FILMS;

EID: 0037420698     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0013-4686(02)00774-0     Document Type: Article

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