Coupled effects of chloride ions and branch chained polypropylene ether LP-1™ on the electrochemical deposition of copper from sulfate solutions

Electrochimica Acta

Volumn 44, Issue 2-3, 1998, Pages 323-335

  Goldbach, Susanne ^a   Messing, Werner ^b   Daenen, Theo ^b   Lapicque, François ^a  

^a UNIVERSITÉ DE LORRAINE   (France)

^b PHILIPS RESEARCH LABORATORIES   (Netherlands)

Author keywords

Copper electrodeposition; Effect of additives; Impedance measurements; Sulfate bath; Voltammetry

Indexed keywords

ADDITIVES; ADSORPTION; CAPACITANCE; COMPLEXATION; CURRENT DENSITY; DESORPTION; DIFFUSION IN SOLIDS; ELECTRIC IMPEDANCE MEASUREMENT; ELECTRODEPOSITION; POLYETHERS; REACTION KINETICS; SULFURIC ACID;

COPPER SULFATE; POLYPROPYLENE ETHER; VOLTAMMETRY;

COPPER;

EID: 0032315108     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0013-4686(98)00112-1     Document Type: Article

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