Microstructural investigation of electrodeposited CuAg-thin films

Microelectronic Engineering

Volumn 70, Issue 2-4, 2003, Pages 506-511

  Strehle, S ^a   Menzel, S ^a   Wendrock, H ^a   Acker, J ^a   Wetzig, K ^a  

^a IFW DRESDEN   (Germany)

Author keywords

CuAg alloy thin film; Electrochemical deposition; Microstructure

Indexed keywords

COPPER COMPOUNDS; CRYSTAL STRUCTURE; CURRENT DENSITY; ELECTRODEPOSITION; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; MICROSTRUCTURE; SOLID SOLUTIONS; SUBSTRATES; X RAY DIFFRACTION ANALYSIS;

MICROSTRUCTURAL INVESTIGATIONS;

THIN FILMS;

EID: 0142106884     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(03)00422-2     Document Type: Conference Paper

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