Strain mapping on gold thin film buckling and silicon blistering

Materials Research Society Symposium Proceedings

Volumn 875, Issue , 2005, Pages 263-268

  Goudeau, P ^a   Tamura, N ^b   Parry, G ^a   Colin, J ^a   Coupeau, C ^a   Cleymand, F ^c   Padmore, H ^b  

^a Lab de Métallurgie Physique   (France)

^b LAWRENCE BERKELEY NATIONAL LABORATORY   (United States)

^c INSTITUT JEAN LAMOUR   (France)

Author keywords

Delamination; Micro X ray diffraction; Residual stresses; Strain mapping; Thin film

Indexed keywords

COMPRESSIVE STRESS; DELAMINATION; RESIDUAL STRESSES; SILICON; SINGLE CRYSTALS; STRAIN; THIN FILMS; X RAY DIFFRACTION ANALYSIS;

CRYSTAL SURFACES; MICRO X-RAY DIFFRACTION; STRAIN MAPPING;

BUCKLING;

EID: 30644475290     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-875-o10.4     Document Type: Conference Paper

References (5)

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2. C. Coupeau, F. Cleymand and J. Grilhé, Scripta mater. 43, 187 (2000).
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4. P. Goudeau, P. Villain, N. Tamura, H. Padmore, Applied Physics Letters 83, 51 (2003).
5. N. Tamura, A. A. MacDowell, R. Spolenak, B. C. Valek, J. C. Bravman, W. L. Brown, R. S. Celestre, H. A. Padmore, B.W. Batterman and J. R. Patel, J. Synchrotron Rad. 10, 137 (2003).