Buckling delamination in compressed multilayers on curved substrates with accompanying ridge cracks

Journal of the Mechanics and Physics of Solids

Volumn 54, Issue 5, 2006, Pages 1004-1028

  Faulhaber, S ^a   Mercer, C ^a   Moon, M W ^b   Hutchinson, J W ^b   Evans, A G ^a  

^a University of California   (United States)

^b HARVARD UNIVERSITY   (United States)

Author keywords

Curved substrates; Delamination; Interface toughness; Inverse problem; Thermal barrier coatings

Indexed keywords

BUCKLING; COMPACTION; CRACK INITIATION; DELAMINATION; INTERFACES (MATERIALS); INVERSE PROBLEMS; STRESS ANALYSIS; SUBSTRATES; THERMAL BARRIER COATINGS; TOUGHNESS;

CURVED SUBSTRATES; INTERFACE TOUGHNESS; RIDGE CRACKS;

MULTILAYERS;

EID: 32444434592     PISSN: 00225096     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmps.2005.11.005     Document Type: Article

References (22)

1. S.-J. Cho, J.-W. Chung, and K.-R. Lee Characterization of the mechanical properties of diamond-like carbon films Diamond Relat. Mater. 14 2004 1270 1276
2. D.R. Clarke, and C.G. Levi Materials design for the next generation thermal barrier coatings Annu. Rev. Mater. Res. 33 2003 383 417
3. A.G. Evans, J.W. Hutchinson, and Y. Wei Interface adhesion: effects of plasticity and segregation Acta Mater. 47 1999 4093 4113
4. A.G. Evans, D.R. Mumm, J.W. Hutchinson, G.H. Meier, and F.S. Pettit Mechanisms controlling the durability of thermal barrier coatings Prog. Mater. Sci. 46 5 2001 505 553
5. L.B. Freund, and S. Suresh Thin Film Materials: Stress, Defect Formation and Surface Evolution 2004 Cambridge University Press Cambridge
6. 3 interfaces Acta Mater. 45 1997 3503 3514
7. J.W. Hutchinson Delamination of compressed films on curved substrates J. Mech. Phys. Solids 50 2001 1847 1864
8. J.W. Hutchinson, and Z. Suo Mixed mode cracking in layered materials Adv. Appl. Mech. 29 1992 63 191
9. C.A. Johnson, J.A. Ruud, R. Bruce, and D. Wortman Relationships between residual stress, microstructure and mechanical properties of electron beam-physical vapor deposition thermal barrier coatings Surf. Coat. Technol. 108-109 1998 80 85
10. A. Lee, B.M. Clemens, and W.D. Nix Stress induced delamination methods for the study of adhesion of Pt thin films to Si Acta Mater. 52 2004 2081 2093
11. K.-R. Lee, Y.-J. Baik, K.Y. Eun, and S. Han Precursor effect on the structure and properties of diamond-like carbon films Diam. Relat. Mater. 3 1994 1230 1234
12. C.G. Levi Emerging materials and processes for thermal barrier systems Curr. Opin. Solid St. M. 8 2004 77 91
13. D.M. Lipkin, and D.R. Clarke Measurement of the stress in oxide scales formed by oxidation of aluminum containing alloys Oxid. Met. 45 1996 267 280
14. Q. Ma, and D.R. Clarke Stress measurement in single-crystal and polycrystalline ceramics using their optical fluorescence J. Am. Ceram. Soc. 76 1993 1433 1440
15. M.-W. Moon, J.-W. Chung, K.-R. Lee, K.H. Oh, R. Wang, and A.G. Evans An experimental study of the influence of imperfections on the buckling of compressed thin films Acta Mater. 50 2002 1219 1227
16. M.-W. Moon, H.M. Jensen, K.H. Oh, J.W. Hutchinson, and A.G. Evans The characterization of telephone cord buckling of compressed thin films on substrates J. Mech. Phys. Solids 50 2002 2355 2377
17. G. Parry, J. Colin, C. Coupeau, F. Foucher, A. Cunetiere, and J. Grilhe Effect of substrate compliance on the global unilateral post-buckling of coatings: AFM observations and finite element calculations Acta Mater. 53 2005 441 447
18. M.J. Stiger, N.M. Yanar, M.G. Topping, F.S. Pettit, and G.H. Meier Thermal barrier coatings for the 21st century Z. Metallkd. 90 1999 1069 1078
19. H. Tada, P.C. Paris, and G.R. Irwin The Stress Analysis of Cracks Handbook 2001 ASME Press New York
20. M.D. Thouless Combined buckling and cracking of films J. Am. Ceram. Soc. 76 1993 2936 2938
21. T. Xu, S. Faulhaber, C. Mercer, M. Maloney, and A.G. Evans Observations and analyses of failure mechanisms in thermal barrier systems with two phase bond coats based on NiCoCrAlY Acta Mater. 52 2004 1439 1450
22. W. Zhang, J.R. Smith, X.-G. Wang, and A.G. Evans Influence of sulfur on the adhesion of the nickel/alumina interface Phys. Rev. B 67 24 2003 245414