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Polymer (Korea)

Volumn 31, Issue 5, 2007, Pages 410-416

Study for mechanical properties of electroless (Ni/Au) plated monodisperse polymer particles

(4) Kim, Dong Ok a Jin, Jeong Hee a Shon, Won Il a Oh, Seok Heon a

a Hanwha Corporation (South Korea)

Author keywords

Electroless plating; Mechanical property; Monodisperse polymer particle; Seeded polymerization; Swelling ratio

Indexed keywords

EID: 44649194645 PISSN: 0379153X EISSN: None Source Type: Journal
DOI: None Document Type: Article

Times cited : (3)

References (21)

1
- 44649087166
- th
- th Int'l Symposium on Advanced Packing Materials, 2004.
- (2004) Int'l Symposium on Advanced Packing Materials
- Watanabe, I.¹ Fujinawa, T.² Arifuku, M.³ Fujii, M.⁴ Gotoh, Y.⁵

2
- 0032093992
- R. Joshi, Microelectr. J., 29, 343 (1998).
- (1998) Microelectr. J , vol.29 , pp. 343
- Joshi, R.¹

3
- 0035576309
- S. Chang, J. Jou, A. Hsieh, T. Chen, C. Chang, Y. Wang, and C. Hung, Microelectron. Reliab., 41, 2001 (2001).
- (2001) Microelectron. Reliab , vol.41 , pp. 2001
- Chang, S.¹ Jou, J.² Hsieh, A.³ Chen, T.⁴ Chang, C.⁵ Wang, Y.⁶ Hung, C.⁷

4
- 21044434640
- M. Rizvi, Y. Chan, and A. Sharif, Solder. Surf. Mt. Tech., 17, 40 (2005).
- (2005) Solder. Surf. Mt. Tech , vol.17 , pp. 40
- Rizvi, M.¹ Chan, Y.² Sharif, A.³

5
- 0344240194
- G. Sarkar, S. Mridha, T. Chong, W. Yuen, and S. Kwan, J. Mater. Proc. Tech., 89-90, 484 (1999).
- (1999) J. Mater. Proc. Tech , vol.89-90 , pp. 484
- Sarkar, G.¹ Mridha, S.² Chong, T.³ Yuen, W.⁴ Kwan, S.⁵

6
- 0036681696
- Y. Chan and D. Luk, Microelectron. Reliab., 42, 1185 (2002).
- (2002) Microelectron. Reliab , vol.42 , pp. 1185
- Chan, Y.¹ Luk, D.²

7
- 0036681534
- Y. Chan and D. Luk, Microelectron. Reliab., 42, 1195 (2002).
- (2002) Microelectron. Reliab , vol.42 , pp. 1195
- Chan, Y.¹ Luk, D.²

8
- 0942299008
- Y. Wu, M. Alam, Y. Chan, and B. Wu, Microelectron. Reliab., 44,295 (2004).
- (2004) Microelectron. Reliab , vol.44 , pp. 295
- Wu, Y.¹ Alam, M.² Chan, Y.³ Wu, B.⁴

9
- 1542610631
- A. Seppala and E. Ristolainen, Microelectron. Reliab., 44, 639 (2004).
- (2004) Microelectron. Reliab , vol.44 , pp. 639
- Seppala, A.¹ Ristolainen, E.²

10
- 1142288200
- M. Uddin, M. Alam, Y. Chan, and H. Chan, Microelectron. Reliab., 44, 505 (2004).
- (2004) Microelectron. Reliab , vol.44 , pp. 505
- Uddin, M.¹ Alam, M.² Chan, Y.³ Chan, H.⁴

11
- 5844372922
- J. M. Goward, D. C. Whalley, and D. J. Williams, Microelectr. Int., 37, 55 (1995).
- (1995) Microelectr. Int , vol.37 , pp. 55
- Goward, J.M.¹ Whalley, D.C.² Williams, D.J.³

12
- 0030683766
- D. C. Whalley, S. H. Mannan, and D. J. Williams, Assembly Autom., 17, 66 (1997).
- (1997) Assembly Autom , vol.17 , pp. 66
- Whalley, D.C.¹ Mannan, S.H.² Williams, D.J.³

13
- 0032094229
- C. N. Oguibe, S. H. Mannan, D. C. Whalley, and D. J. Williams, IEEE T Compon. Pack B, 21, 235 (1998).
- (1998) IEEE T Compon. Pack B , vol.21 , pp. 235
- Oguibe, C.N.¹ Mannan, S.H.² Whalley, D.C.³ Williams, D.J.⁴

14
- 44649110324
- US Patent 5,486,941
- K. Saiuchi, M. Kohara, K. Yamada, and K. Kanki, US Patent 5,486,941 (1996).
- (1996)
- Saiuchi, K.¹ Kohara, M.² Yamada, K.³ Kanki, K.⁴

15
- 44649163981
- US Patent 5,615,031
- K. Saiuchi, M. Kohara, K. Yamada, and K. Kanki, US Patent 5,615,031 (1997).
- (1997)
- Saiuchi, K.¹ Kohara, M.² Yamada, K.³ Kanki, K.⁴

16
- 44649089484
- J. K. Park and P. M. Chung, Korea Patent 10-2004-002183 (2004).
- J. K. Park and P. M. Chung, Korea Patent 10-2004-002183 (2004).

17
- 33845359856
- D. O. Kim, J. H. Jin, W. I. Shon, and S. H. Oh, Polymer (Korea), 30, 332 (2006).
- (2006) Polymer (Korea) , vol.30 , pp. 332
- Kim, D.O.¹ Jin, J.H.² Shon, W.I.³ Oh, S.H.⁴

18
- 44649088454
- D. O. Kim, W. I. Shon, J. H. Jin, and S. H. Oh, Polymer (Korea), 31, 184 (2007).
- (2007) Polymer (Korea) , vol.31 , pp. 184
- Kim, D.O.¹ Shon, W.I.² Jin, J.H.³ Oh, S.H.⁴

19
- 33749130263
- Sept, p
- C. D. Iacovangelo, Plating & Surface Finishing, Sept., p.77 (1995).
- (1995) Plating & Surface Finishing , pp. 77
- Iacovangelo, C.D.¹

20
- 0031125939
- April, p
- K. Hagiwara, J. Watanabe, and H. Honma, Plating & Surface Finishing, April, p.74 (1997).
- (1997) Plating & Surface Finishing , pp. 74
- Hagiwara, K.¹ Watanabe, J.² Honma, H.³

21
- 0032677287
- I. Motizuki, K. Izawa, J. Watanabe, and H. Honma, Trans. IMF, 77, 41 (1997).
- (1997) Trans. IMF , vol.77 , pp. 41
- Motizuki, I.¹ Izawa, K.² Watanabe, J.³ Honma, H.⁴

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.