Anisotropic conducting adhesives for electronic assembly

Assembly Automation

Volumn 17, Issue 1, 1997, Pages 66-74

  Whalley, David C ^a   Mannan, Samjid H ^a   Williams, David J ^a,b  

^a LOUGHBOROUGH UNIVERSITY   (United Kingdom)

^b Dept of Manufacturing Processes ^*

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; CONDUCTIVE MATERIALS; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; GLASS FIBER REINFORCED PLASTICS; MATHEMATICAL MODELS; PRINTED CIRCUIT BOARDS; SILVER COMPOUNDS; THERMOPLASTICS; THERMOSETS; THICK FILMS; WELDS;

ANISOTROPIC CONDUCTING ADHESIVES; ELECTRONIC ASSEMBLY; GLASS REINFORCED POLYMER PRINTED CIRCUIT BOARD; SILVER PALLADIUM THICK FILM;

ADHESIVES;

EID: 0030683766     PISSN: 01445154     EISSN: None     Source Type: Journal    
DOI: 10.1108/01445159710163481     Document Type: Article

References (11)

1. Kivilahti, J. (1994), "Development of solder-filled uniaxially conducting adhesives". Proceedings of the First International Conference on Adhesive Joining Technology in Electronics Manufacturing, Berlin.
2. Mannan, S.H., Whalley, D.C., Ogunjimi, A.O. and Williams, D.J. (1995), "Modelling of the initial stages of the anisotropic adhesive joint assembly process", Proceedings of 1995 Japan International Electronic Manufacturing Symposium, Omiya, pp. 142-5.
3. Mannan, S.H., Whalley, D.C., Ogunjimi, A.O. and Williams, D.J. (1996), "Assembly of planar array components using anisotropic conducting adhesives - a benchmark study: part II - theory", IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part C, Vol. 19 No. 4.
4. Ogunjimi, A.O., Mannan, S.H., Whalley, D.C. and Williams, D.J. (1995), "The assembly process for anisotropic conductive joints - some new experimental and theoretical results", Proceedings of Latest Achievements in Conducting Adhesive Joining in Electronics Packaging, Eindhoven, pp. 129-34.
5. Ogunjimi, A.O., Mannan, S.H., Whalley, D.C. and Williams, D.J., (1996), "Assembly of planar array components using anisotropic conducting adhesives - a benchmark study: part 1 - experiment", IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part C, Vol. 19 No. 4.
6. Tummala, R.R. and Rymaszewski, E.J. (1989), Microelectronics Packaging Handbook, Van Nostrand Reinhold, New York, NY.
7. van Noort, H.M., Kloos, M.J.H. and Schafer, H.E.A. (1994), "Anisotropic conductive adhesives for chip on glass and other flip chip applications", Proceedings of the First International Conference on Adhesive Joining Technology in Electronics Manufacturing, Berlin.
8. Watanabe, I., Takemura, K., Shiozawa, N., Watanabe, O., Kojima, K. and Ohta, T. (1995), "Flip-chip interconnection to various substrates using anisotropic conducting adhesive films", Proceedings of Latest Achievements in Conducting Adhesive Joining in Electronics Packaging, Eindhoven, pp. 45-54.
9. Whalley, D.C., Williams, D.J., Ogunjimi, A.O., Boyle, O.A. and Goward J. M. (1993), "A comparison of the behaviour of isotropic and anisotropic conducting adhesives", ASME Production and Engineering Division, Vol. 65/Electrical and Electronic Packaging Division, Vol. 5, Proceedings of Manufacturing Aspects in Electronic Packaging, New Orleans, LA, pp. 81-91.
10. Williams, D.J. and Whalley, D.C. (1993), "The effects of conducting particle distribution on the behaviour of anisotropic conducting adhesives: non-uniform conductivity and shorting between connections", Journal of Electronics Manufacturing, Vol. 3, pp. 85-94.
11. Williams, D.J., Whalley, D.C., Boyle, O.A. and Ogunjimi, A.O. (1993), "Anisotropic conducting adhesives for electronic interconnection", Soldering & Surface Mount Technology, No. 14, pp. 4-8.