Preparation of anisotropic conductive fine particles by electroless nickel plating

Transactions of the Institute of Metal Finishing

Volumn 77, Issue 1, 1999, Pages 41-42

  Motizuki, L ^a   Izawa, K ^b   Watanabe, J ^a   Honma, H ^b  

^a Graduate School

^b KANTO GAKUIN UNIVERSITY   (Japan)

Author keywords

Anisotropic conductive particles; Electroless nickel plating; Leadless connection

Indexed keywords

AMMONIUM COMPOUNDS; ANISOTROPY; COMPLEXATION; CONDUCTIVE MATERIALS; ELECTROLESS PLATING; PARTICLES (PARTICULATE MATTER); SURFACE ACTIVE AGENTS;

AMMONIUM ACETATE;

NICKEL PLATING;

EID: 0032677287     PISSN: 00202967     EISSN: None     Source Type: Journal    
DOI: 10.1080/00202967.1999.11871242     Document Type: Article

References (8)

1. E. Takeshima, and A. Sakakura, Surf. Technol. 1990, 41(3)98.
2. C.D. Lacovangelo, Plating & Surface Finishing 1995, Sept. 77.
3. H. Honma, K. Hagiwara and N. Saito, J. IPC 1995, 10(3)77.
4. S. L. Brandow, W. J. Dressick, C. R. K. Marrian, G-M. Chow and J. M. Calvert, J. Electrochem. Soc. 1995, 142(7) July, 2233.
5. E. Queau, J.R. Martin and G. Stremsdoerfer, J. Eleclrochem. Soc. 1995, 142(10) Oct., 3373.
6. H. Yoshiki, K. Hashimoto and A. Fujishima, J. Electrochem. Soc. 1995, 142(2) February, 428.
7. K. Naito, T. Matunami and K. Okuno, J. Electrochem. 1994, 24808-813.
8. N.M. Martyak, S. Wetterer, L. Harrison, M. McNeil, R. Heu and A. Albert Neiderer, Plating & Surface Finishing 1993, June, 60.