Shearing tests of solder joints on tape ball grid array substrates

Journal of Materials Research

Volumn 21, Issue 9, 2006, Pages 2224-2231

  Wu, B Y ^a   Zhong, H W ^a   Chan, Y C ^a   Alam, M O ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

DISLOCATIONS (CRYSTALS); DUCTILITY; FRACTURE MECHANICS; INTERMETALLICS; SHEAR DEFORMATION; SURFACE PROPERTIES;

INTERFACIAL SEPARATION; SHEARING FORCE; TAPE BALL GRID ARRAY (TBGA);

SOLDERED JOINTS;

EID: 33845652093     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/jmr.2006.0296     Document Type: Article

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