Low loss dielectric materials for LTCC applications: A review

International Materials Reviews

Volumn 53, Issue 2, 2008, Pages 57-90

  Sebastian, M T ^a   Jantunen, H ^b  

^a REGIONAL RESEARCH LABORATORY CSIR   (India)

^b UNIVERSITY OF OULU   (Finland)

Author keywords

Constraint sintering; Dielectric; Glass; LTCC; Permittivity; Q value; Shrinkage; Temperature compensation

Indexed keywords

BUILDING MATERIALS; CELLULAR TELEPHONE SYSTEMS; CERAMIC CAPACITORS; CERAMIC MATERIALS; COMMUNICATION; COMMUNICATION SYSTEMS; COMPUTER NETWORKS; CONSUMER PRODUCTS; ELECTRONIC COMMERCE; ENGINEERS; FIBER OPTIC SENSORS; GARNETS; GLOBAL SYSTEM FOR MOBILE COMMUNICATIONS; INDUSTRIAL ECONOMICS; MATERIALS PROPERTIES; METALLIZING; MINERALS; MOBILE COMPUTING; NUMERICAL METHODS; PHOTORESISTS; PIGMENTS; PRECIOUS METALS; SILICATE MINERALS; SILVER; SINTERING; STEEL ANALYSIS; SULFATE MINERALS; TECHNOLOGY; TELECOMMUNICATION SYSTEMS; THREE DIMENSIONAL;

(PL) PROPERTIES; ALL OVER THE WORLD; ASM INTERNATIONAL (CO); COMPONENT MANUFACTURERS; ELECTRONIC COMPONENTS; ELECTRONIC MARKETS; GLASS PHASES; HIGH-FREQUENCY (HF); HIGH-FREQUENCY APPLICATIONS; LIGHT WEIGHTING; LOW DIELECTRICS; LOW LOSSES; LOW TEMPERATURE CO-FIRED CERAMIC (LTCC) TECHNOLOGY; MICROWAVE PRODUCTS; NOVEL MATERIALS; RAPID GROWTH; SILVER ELECTRODES; SINTERING TEMPERATURES; SUBSTRATE MATERIALS; THREE DIMENSIONAL (3D); WIRELESS COMMUNICATION SYSTEMS;

DIELECTRIC MATERIALS;

EID: 44649118570     PISSN: 09506608     EISSN: None     Source Type: Journal    
DOI: 10.1179/174328008X277524     Document Type: Review

References (377)

1. L. Hongwei, H. L. Barnes, J. Laskar and D. Estrich: IEEE Trans. Microwave Theory Tech., 2000, 48, 2644-2651.
2. T. A. Midford, J. J. Wooldridge and R. L. Sturdivant: IEEE Trans. Antennas Propag., 1995, 43, 983-991.
3. R. R. Tummala Rao: J. Am. Ceram. Soc., 1991, 74, 895-908.
4. A. L. Eustice, S. J. Horowitz, J. J. Stewart, A. R. Travis and H. T. Sawhillm: Proc. 36th Electron. Compon. Conf., Seattle, WA, USA, May 1986, IEEE, 37-47.
5. J. Muller, H. Thust and K. H. Drue: Int. J. Microcircuits Electron. Packag., 1995, 18, 200-206.
6. M. A. Rodriguez, P. Yang, P. Kotula and D. Dimos: J. Electroceram., 2000, 5, 217-223.
7. H. T. Sawhil: Ceram. Trans., 1987, 26, 307-319.
8. K. W. Long and K. M. Luk: IEEE Trans. Antenna Propag., 1995, 43, 517-519.
9. K. Delaney, J. Barret, J. Barton and R. Doyle: IEEE Trans. Adv. Packag., 1999, 22, 68-77.
10. R. Ludwig and P. Bretchko: 'RF circuit design: theory and applications', 65; 2000, Upper Saddle River, NJ, Prentice Hall.
11. Y. Imanaka: 'Multilayers low temperature cofired ceramics (LTCC) technology', Chapter 2; 2005, New York, Springer.
12. R. E. Mistler and E. R. Twiname: 'Tape casting, theory and practice'; 2000, Westerville, OH, The American Ceramic Society.
13. S. Dzuirdzia, S. Nowack, M. Ciez and W. Gregorcyzk: Proc. 26th Int. Conf. on 'International microelectronics and packaging society - Poland Chapter', Warshaw, Poland, September 2002, IMAPS, 409.
14. J. Hagberg, M. Pudas, M. Kittilä and S. Leppävuori: Proc. Int. Symp. on 'Microelectronics', Baltimore, MD, USA, October 2001, IMAPS, 681-687.
15. H. Jantunen, T. Kangasvieri, J. Vähäkangas and S. Leppävuori: J. Eur. Ceram. Soc., 2003, 23, 2541-2548.
16. H. Thust, K. H. Drue, J. Mueller, T. Thelemann, T. Tuschiek, J. Chilo, C. Golovanov and F. Ndagijimana: Microwave J., 1998, 41, 70-79.
17. W. Li and J. Lannutti: IEEE Trans. Compon. Packag. Technol., 2005, 28, 149-156.
18. J.-H. Jean and C.-R. Chang: J. Mater. Res., 1997, 12, 2743-2450.
19. T. Cheng and R. Raj: J. Am. Ceram. Soc., 1989, 72, 1649-1655.
20. C. H. Hsueh and A. G. Evans: J. Am. Ceram. Soc., 1985, 68, 120-126.
21. Y. Wang, G. Zhang and J. Ma: Mater. Sci. Eng. B, 2002, B94, 48-53.
22. A. Sutono, D. Heo, Y. J. E. Chen and J. Laskar: IEEE Trans. Microwave Theory Tech., 2001, 49, 1715-1724.
23. M. Ito, K. Maruhashi, K. Ikuina, N. Senba, N. Takahashi and K. Ohata: Int. IEEE MTT-S Microwave Symp. Digest, 2000, 1, 57-60.
24. C. H. Lee, A. Sutono, S. Han and J. Laskar: Int. IEEE MTT-S Microwave Symp. Digest, 2001, 2, 945-948.
25. A. I. Kingon and S. Srinivasan: Nature Mater., 2005, 4, 233-237.
26. V. Gektin, A. Bar-Cohen and S. Witzman: IEEE Trans. Compon. Packag. Technol. A, 1998, 21A, 577-584.
27. B. Schwartz: Am. Ceram. Soc. Bull., 1984, 63, 577-581.
28. L. Devlin, G. Pearson and J. Pittock: Proc. 38th IMAPS Nordic Conf., Oslo, Norway, September 2001, IMAPS, 96-110.
29. S. H. Hall, G. W. Hall and J. A. McCall: 'A high speed digital system design: a hand book of interconnect theory and design practices', 91-92; 2000, New York, John Wiley & Sons.
30. H. Kagata, T. Inoue and J. Kato: Jpn J. Appl. Phys., 1992, 31, 3152-3155.
31. R. L. Whalers, S. J. Stein, Y. D. Huang and M. R. Heinz: 'Lead free multilayer system for telecommunications'; 2001, Prussia, Electro-Science Laboratories.
32. D. I. Amey, M. Y. Keating, M. A. Smith, S. J. Horowitch, P. C. Donahue and C. R. Needes: Proc. Int. Symp. on 'Microelectronics', Boston, MA, USA, September 2000, IMAPS, 654-658.
33. R. Brown: Proc. RF Design '97 Conf. and Exposit., Englewood, FL, USA, 1997, 209-221.
34. R. Kulke, W. Simon, C. Gunner, G. Mollenbeck, D. Kother and M. Rittweger: Proc. IMAPS-Nordic, Stockholm, Sweden, September 2002, IMAPS, 97-102.
35. C. Wang and K. A. Zaki: Proc. Int. IEEE MTT-S Microwave Symp. Digest, 1993, 3, 1041-1044.
36. H. Jantunen and A. Turunen: US Patent 5302924, 1994, USA.
37. H. Jantunen: 'A novel low temperature cofiring ceramic (LTCC) material for telecommunication devices', PhD thesis, University of Oulu, Oulu, Finland, 2001, available at: http://herkules.oulu.fi/ isbn951426553X/isbn951426553X.pdf
38. J. P. Sommer, B. Michel, U. Goebel and J. Jelonnek: Proc. 7th Soc. Conf. on 'Thermal and thermomechanical phenomena in electronic systems', Las Vegas, NV, USA, May 2000, ITHERM, 355-360.
39. C. B. D. Antonio, D. N. Bencoe and K. G. Ewsuk: Proc. Conf. SPIE, Bellingham, WA, USA, 2003, SPIE, 160.
40. S. Knickerbocker, A. H. Kumar and L. W. Herron: Am. Ceram. Soc. Bull., 1993, 72, 90-95.
41. Ferro Coporation: 'FERRO-TAPE-A6', Technical publication, Ferro Coporation, Santa Barbara, CA, USA, 1996.
42. J. H. Jean, T.-H. Kuan and C.-R. Chang: Mater. Chem. Phys., 1995, 41, 123-127.
43. K. Niwa, Y. Imanaka, N. Kamehara and S. Aoki: 'Advances in ceramics', (ed. M. P. Yan et al.), Vol. 26, 323; 1989, Columbus, The American Ceramic Society
44. A. H. Kumar, P. W. McMillan and R. R. Tummala: US Patent 4301324, 1981, USA.
45. O.-H. Kwon and G. L. Messing: J. Am. Ceram. Soc., 1990, 73, 275-281.
46. V. K. Singh: J. Am. Ceram. Soc., 1981, 64, C133-C135.
47. K. G. Ewsuk and L. W. Harrison: 'Advances in ceramics', (ed. C. Handwerker et al.), Vol. 29, 356; 1990, Westerville, OH, The American Ceramic Society.
48. W. D. Kingery, E. Niki and M. D. Narasimhan: J. Am. Ceram. Soc., 1961, 44, 29-34.
49. R. M. German: 'Liquid phase sintering', 65-151; 1985, New York, Plenum Press.
50. J.-H. Jean and T. K. Gupta: J. Mater. Sci., 1992, 27, 1575-1584.
51. J.-H. Jean and T. K. Gupta: J. Mater. Sci., 1992, 27, 4967-4973.
52. J.-H. Jean and T. K. Gupta: J. Mater. Res., 1994, 9, 771-780.
53. J-H. Jean and T. K. Gupta: J. Mater. Res., 1994, 9, 486-492.
54. J.-H. Jean and S.-C. Lin: J. Mater. Res., 1999, 14, 1359-1363.
55. M. Eberstein and W. A. Schiller: Glass Sci. Technol., 2003, 76, 8-16.
56. M. Eberstein and W. A. Schiller: Keramische Zeitschrift, 2003, 55, 344-348.
57. A. L. Eustice, S. J. Horowitz, J. J. Stewart, A. R. Travis and H. T. Sawhill: Proc. 36th Conf. on 'Electronic component', Seattle, WA, USA, May 1986, IEEE, 37-67.
58. T. Noro and H. Tozaki: Japanese Patent No. 6070799A, 1986, Japan.
59. Y. Imanaka, S. Aoki, N. Kamehara and K. Niwa: J. Ceram. Soc. Jpn, 1987, 95, 1119-1121.
60. Y. Imanaka, K. Yamazaki, S. Aoki, N. Kamehara and K. Niwa: J. Ceram. Soc. Jpn, 1989, 97, 309-313.
61. S. Nishigaki, S. Yano, J. Fukuta, M. Fukuyama and T. Fuwa: Proc. Conf. ISHM '85, Reston, VA, USA, November 1985, ISHM, 225-234.
62. G. C. Kuczynski and I. Zaplatynskyj: J. Am. Ceram. Soc., 1956, 39, 349-350.
63. H. Ohsato: J. Ceram. Soc. Jpn, 2006, 113, 703-711.
64. Y. Imanaka and N. Kamehara: J. Ceram. Soc. Jpn, 1992, 100, 558-561.
65. J. I. Steinberg, S. J Horowitz and R. J. Bacher: 'Advances in ceramics', (ed. J. B. Blum et al.), Vol. 19; 1998, Westerville, OH, The American Ceramic Society.
66. R. R. Tummala Rao, P. Garrou, T. Gupta, N. Kuramoto, K. Niwa, Y. Shimada and M. Terasawa: 'Ceramic packaging in: microelectronic packaging hand book: Part II', (ed. R. R. Tummala et al.); 1997, New York, Chapman & Hall.
67. Y. Shimada, Y. Shiozawa, M. Sizuki, H. Takimizawa and Y. Tamashita: Proc. 36th Electron. Compon. Conf., New Orleans, LA, USA, 1984, IEEE, 395-405.
68. K. H. Yoon, S. J. Yoo, W. S. Kim, J. B. Kim and E. S. Kim: Jpn J. Appl. Phys., 1999, 38, 5616-5620.
69. W. D. Kingery: J. Appl. Phys., 1959, 30, 301-306.
70. J.-H. Jean and S.-S. Lin: J. Am. Ceram. Soc., 2000, 83, 1417-1422.
71. C.-S. Chen, C.-C. Chou, W.-J. Shih, K.-S. Liu, C.-S. Chen and I.-N. Lin: Mater. Chem. Phys., 2003, 79, 129-134.
72. S. Kemethmuller, A. Roosen, F. Goetz-Neunhoffer and J. Neubauer: J. Am. Ceram. Soc., 2006, 89, 2632-2637.
73. M. Eberstein, J. Moller, J. Wiegmann and W. A. Schiller: CFI-Ceram. Forum Int., 2003, 80, E39-E46.
74. M.-Z. Jhou and J.-H. Jean: J. Am. Ceram. Soc., 2006, 89, 786-791.
75. J. M. Wu and H. L. Huang: J. Non-Cryst. Solids, 1999, 260, 116-124.
76. K. P. Surendran, P. Mohanan and M. T. Sebastian: J. Solid State Chem., 2004, 177, 4031-4046.
77. T. Takada and K. Kageyama: Jpn J. Appl. Phys., 2005, 44, 6629-6635.
78. H. Zhu, M. Liu, H. Zhou, L. Li and A. Lv: J. Mater. Sci., 2006, 17, 637-641.
79. B.-H. Jung, S.-J. Hwang and H.-S. Kim: J. Eur. Ceram. Soc., 2005, 25, 3187-3193.
80. Y.-J. Choi, J.-H. Park, W.-J. Ko, I.-S. Hwang, J.-H. Park, J.-G. Park and S. Nahm: J. Am. Ceram. Soc., 2006, 89, 562-567.
81. J. H. Park, Y.-J. Choi and J.-H. Park: Mater. Chem. Phys., 2004, 88, 308-312.
82. H. Zhu, M. Lu, H. Zhou, L. Li and A. Lv: J. Mater. Sci., Mater. Electron., 2006, 17, 637-641.
83. A. Yang, H. Lin, L. Luo and W. Chen: Jpn J. Appl. Phys., 2006, 45, 1698-1701.
84. S.-G. Kim, J.-S. Park, J.-S. An, K. S. Hong, H. Shin and H. Kim: J. Am. Ceram. Soc., 2006, 89, 902-907.
85. O. Dernovsek, A. Naeini, G. Preu, W. Wersing, M. Eberstein and W. A. Schiller: J. Eur. Ceram. Soc., 2001, 21, 1693-1697.
86. N. Ichinose and H. Yamamota: Ferroelectrics, 1997, 201, 255-262.
87. H. Tamura, H. Kagata, T. Inoue and I. Kameyama: Jpn J. Appl. Phys., 1992, 31, 3152-3155.
88. L. Navias and R. L Green: J. Am. Ceram. Soc., 1946, 29, 267-276.
89. J. O. Israd: Proc. Int. Conf. on 'Comp. Mater. Electron. Pack. Eng.', 1961, IEEE, 3636.
90. E. B. Shand: 'Glass engineering hand book', (ed. E. B. Shand), 16; 1958, New York, McGraw-Hill.
91. K. Wakino: Proc. ISIF, 1992, 308-335.
92. A. R. von Hippel (ed.): 'Dielectric materials and applications'; 1954, Cambridge, MIT Press.
93. D. L. Kinser: 'Physics of electronic ceramics: Part A', (ed. L. L. Hench et al.); 1971, New York, Marcel & Dekker.
94. A. I. Berezhoni: 'Glass ceramics and photo-citalls', (ed. A. G. Pincus); 1970, New York, Plenum Press.
95. G. A. Pavlova and V. G. Chistoserdov: 'Structure of glass', Vol. 3; 1964, New York, Consultants Bureau.
96. H. Mandai, K. Sugo, K. Tsukamoto, H. Tani and M. Murata: Proc. IMC, Kobe, Japan, May 1986, 61-64.
97. H. Mandai: Proc. 2nd Int. Cong. on 'Ceramic science and technology', Orlando, FL, USA, November 1990, 83-86.
98. H. Mandai and S. Okube: Ceram. Trans., 1992, 32, 91-101.
99. T. Takada, H. Yammoto and K. Kageyama: Jpn J. Appl. Phys., 2003, 42, 6162-6167.
100. H. Kagata, R. Saito and H. Katsumura: J. Electroceram., 2004, 13, 277-280.
101. C.-R. Chang and J.-H. Jean: J. Am. Ceram. Soc., 1999, 82, 1725-1732.
102. Y. Kobayashi and E. Kato: J. Am. Ceram. Soc., 1994, 77, 833-834.
103. C.-L. Lo, J.-G. Duh, B.-S. Chiou and W.-H. Lee: J. Am. Ceram. Soc., 2002, 85, 2230-2235.
104. E. S. Lim, B. S. Kim, J.-H. Lee and J.-J. Kim: J. Non-Cryst. Solids, 2006, 352, 821-826.
105. T. Takada, S. F. Wang, S. Yoshikawa, S.-J. Jang and R. E. Newnham: J. Am. Ceram. Soc., 1994, 77, 1909-1916.
106. H. Ohsato, T. Tsunooka, M. Ando, Y. Ohishi, Y. Miyauchi and K. Kakimoto: J. Korean Ceram. Soc., 2003, 40, 350-353.
107. W. C. J. Jei, C. L. Chen and A. Roosen: Key Eng. Mater., 2005, 280-283, 929-934.
108. M.-H. Lim, J.-H. Park, H.-G. Kim and M.-J. Yoo: Proc. IEEE Int. Conf. on 'Properties and applications of dielectric materials', Nagoya, Japan, June 2003, IEEE, Vol. 2, 757-760.
109. J. J. Seo, D. J. Shin and Y. S. Cho: J. Am. Ceram. Soc., 2006, 89, 2352-2355.
110. C.-L. Chen, W.-J. Wei and A. Roosen: J. Eur. Ceram. Soc., 2006, 26, 59-65.
111. I. N. Chakraborty, J. E. Shelby and R. A. Condrate: J. Am. Ceram. Soc., 1984, 67, 782-785.
112. Y.-C. Fang and J.-H. Jean: Jpn J. Appl. Phys., 2006, 45, 6357-6361.
113. S. Dai, R.-F. Huang and D. L Wilcox: J. Am. Ceram. Soc., 2002, 85, 828-832.
114. D. Wilcox, R.-F. Huang and S. Dai: 'Ceramic transaction, multilayer electronic ceramic devices', (ed. J.-H. Jean et al.), Vol. 97, 201-213; 1998, Westerville, OH, USA, The American Ceramic Society.
115. S. Dai, R.-F. Huang and D. Wilcox: Proc. 1st China Int. Conf. on 'High performance ceramics', Beijing, China, October 1998.
116. E. A. Barringer and H. K. Bowen: J. Am. Ceram. Soc., 1982, 65, C199-C201.
117. H. Hahn, J. Logas and R. S. Averback: J. Mater. Res., 1990, 5, 609-614.
118. D.-W. Kim, T. G. Kim and K. S. Hong: Mater. Res. Bull., 1999, 34, 771-781.
119. D.-W. Kim, B. Park, J.-H. Chung and K. S Hong: Jpn J. Appl. Phys., 2000, 39, 2696-2700.
120. S. Yano, N. Hirofumi, Y. Komaki and T. Hirai: US Patent 5232765, 1993, USA.
121. S.-H. Yoon, D.-W. Kim, S.-Y. Cho and K. S. Hong: J. Eur. Ceram. Soc., 2003, 23, 2549-2552.
122. J.-H. Jean and S.-C. Lin: J. Mater. Res., 1999, 14, 1359-1363.
123. X. M. Cui, J. Zhou, C. L. Miao and J. H. Shen: Rare Earth Mater. Eng., 2005, 34, 410-415.
124. J.-H. Jean and T. H. Kuan: Jpn J. Appl. Phys., 1995, 34, 1901-1905.
125. Y. Miyauchi and T. Arashi: J. Jpn Soc. Powder Powder Metall., 2005, 52, 271-275.
126. D. M. Mattox, S. R. Gurkovich, J. A. Olenik and K. M. Mason: Ceram. Eng. Sci. Proc., 1988, 9, 1567-1578.
127. R. A. Gudla: Am. Ceram. Soc. Bull. , 1971, 50, 555-557.
128. M. G. M. U. Ismail and H. Aria: J. Ceram. Soc. Jpn, 1992, 100, 1385-1389.
129. C.-L. Lo, J.-G. Duh, B.-S. Chiou and W.-H. Lee: Mater. Res. Bull., 2002, 37, 1949-1960.
130. C.-L. Lo, J.-G. Duh, B.-S. Chiou and W.-H. Lee: J. Mater. Sci., 2002,38, 693-698.
131. V. M. F. Marques, D. U. Tulyaganov, S. Agathopoulos, V. K. Gataullin, G. P. Kothoyal and J. M. F. Ferreira: J. Eur. Ceram. Soc., 2006, 26, 2503-2510.
132. I. Levin, T. G. Amos, J. C. Nino, T. A Vanderah, I. M. Reaney, C. A. Randall and M. T. Lanagan: J. Mater. Res., 2002, 17, 1406-1411.
133. M. Valant and P. K. Davies: J. Am. Ceram. Soc., 2000, 83, 147-153.
134. H.-J. Youn T. Sogabe, C. A. Randall, T. R. Shrout and M. T. Lanagan: J. Am. Ceram. Soc., 2001, 84, 2557-2562.
135. H. Du, X. Yao and L. Zhang: Ceram. Int., 2002, 28, 231-234.
136. H. C. Ling, M. F. Yan and W. W. Rhodes: J. Mater. Res., 1990, 5, 1752-1762.
137. M. F. Yan, H. C. Ling and W. W. Rhodes: J. Am. Ceram. Soc., 1990, 73, 1106-1106.
138. X. Wang, H. Wang and X. Yao: J. Am. Ceram. Soc., 1997, 80, 2745-2748.
139. D. Liu, Y. Liu, S.-Q. Huang and X. Yao: J. Am. Ceram. Soc., 1993, 76, 2129-2132.
140. S. L. Swartz and T. R. Shrout: US Patent 5449652, 1994, USA.
141. D. P. Cann, C. A. Randall and T. R. Shrout: Solid State Commun., 1996, 100, 529-534.
142. H. J. Youn, C. A. Randall, A. Chen, T. R. Shrout and M. T. Lanagan: J. Mater. Res., 2002, 17, 1502-1506.
143. H. B. Hong, D.-W. Kim and K. S. Hong: Jpn J. Appl. Phys., 2003, 42, 5172-5175.
144. H. Wang, H. Du, Z. Peng, M. Zhang and X. Yao: Ceram. Int., 2004, 30, 1225-1229.
145. B. Shen, X. Yao, L. Kang and D. Peng: Ceram. Int., 2004, 30, 1203-1206.
146. H. Wang, Z. Peng, H. Du, T. Yao and X. Yao: Ceram. Int., 2004, 30, 1219-1223.
147. S.-Y. Chen and Y.-J. Lin: Jpn J. Appl. Phys., 2001, 40, 3305-3310.
148. G.-K. Choi, D.-W. Kim, S.-Y. Cho and K. S. Hong: Ceram. Int., 2004,30, 1187-1190.
149. E. A. Nenesheva and N. F. Kartenko: J. Eur. Ceram. Soc., 2006, 26, 1929-1922.
150. W. F. Su and S. C. Lin: J. Eur. Ceram. Soc., 2003, 23, 2593-2596.
151. C. A. Randall, J. C. Nino, A. Baker, H.-J. Youn, A. Hitomi, R. Thayer, L. F. Edge, T. Sogabe, D. Anderson, T. R. Shrout, S. Trolier-McKinstry and M. T. Lanagan: Am. Ceram. Soc. Bull., 2003,82, 644-652.
152. A. Baker, M. Lanagan, C. Randall, E. Semouchkina, G. Semouchkin, K. Z. Rajab, R. Eitel, R. Mitra, S. Rhee, P. Geggier, C. Duschl and G. Fuhr: Int. J. Appl. Ceram. Technol., 2005,2, 514-520.
153. N. Wang, M.-Y. Zhao, W. Li and Z.-W. Yin: Ceram. Int., 2004, 30, 1017-1022.
154. Y.-C. Chen, W.-C. Tzou, C.-F. Yang and P.-S. Cheng: Jpn J. Appl. Phys., 2001, 40, 3252-3155.
155. H. R. Lee, K. H. Yoon and E. S. Kim: Jpn J. Appl. Phys., 2003, 42, 6168-6171.
156. E. S. Kim and W. Choi: J. Eur. Ceram. Soc., 2006, 26, 1761-1766.
157. C.-L. Huang, M.-H. Weng and C.-C. Yu: Ceram. Int., 2001, 27, 343-350.
158. C.-L. Huang, M.-H. Weng and C.-C. Wu: Jpn J. Appl. Phys., 2000, 39, 3506-3510.
159. C.-L. Huang and M.-H. Weng: Mater. Lett., 2000, 43, 32-35.
160. N. Wang, M.-Y. Zhao, Z.-W. Yin and W. Li: Mater. Res. Bull, 2004, 39, 439-448.
161. C.-L. Huang, M.-H. Weng and G.-M. Shan: J. Mater. Sci., Mater. Electron., 2000, 35, 5443-5447.
162. D. Shihua, Y. Xi and Y. Yang: Ceram. Int., 2004, 30, 1195-1198.
163. H. Ohsato: J. Ceram. Soc. Jpn, 2006, 113, 703-711.
164. J.-M. Yoon, J.-A. Lee, J.-H. Lee, J.-J. Kim and S.-H. Cho: J. Eur. Ceram. Soc., 2006, 26, 2129-2133.
165. J.-B. Lim, K.-H. Cho, S. Nahm, J.-H. Paik and J.-H. Kim: Mater. Res. Bull., 2006, 41, 1868-1874.
166. I.-S. Cho, D.-W. Kim, J.-R. Kim and K. S. Hong: Ceram. Int., 2004, 30, 1181-1185.
167. C. F. Yang, L. Wu and T. S. Wu: J. Mater. Sci., 1992, 27, 6573-6578.
168. C.-C. Cheng, T. Hsieh, I.-N. Lin: J. Eur. Ceram. Soc., 2004, 24, 1787-1790.
169. C.-C. Cheng, T.-E. Hsieh and I.-N. Lin: J. Eur. Ceram. Soc., 2003, 23, 2553-2558.
170. C.-C. Cheng, T.-E. Hsieh and I.-N. Lin: Mater. Chem. Phys., 2003, 79, 119-123.
171. H. Choy, Y. S. Han, J. H. Sohn and M. Itoh: J. Am. Ceram. Soc., 1995, 78, 1169-1172.
172. S. Nishigaki, S. Yano, H. Kato, T. Hirai and T. Nomura: J. Am. Ceram. Soc., 1988, 71, C-11-C-16.
173. S.-F. Wang, C.-C. Chiang and C.-H. Wang: Mater. Chem. Phys., 2003, 79, 256-260.
174. W. Huang, K.-S. Liu, L.-W. Chu, G.-H Hsiue and I.-N. Lin: J. Eur. Ceram. Soc., 2003, 23, 2559-2564.
175. J.-A. Lee, J.-H. Lee and J.-J. Kim: J. Eur. Ceram. Soc., 2006, 26, 2111-2115.
176. Y.-G. Choi, J.-H. Park, W.-J. Ko, J.-H. Park, S. Nahm and J.-G. Park: J. Electroceram., 2005, 14, 157-162.
177. M. Maeda, T. Yamamura and T. Ikeda: Jpn J. Appl. Phys., 1987, 26, 76-79.
178. H. J. Lee, K. S. Hong, S. J. Kim and I. T. Kim: Mater. Res. Bull., 1997, 32, 847-855.
179. D.-W. Kim, K. H. Ko and K. S. Hong: J. Am. Ceram. Soc., 2001, 84, 1286-1290.
180. S.-H. Wee, D.-W. Kim, S.-I. Yoo and K. S. Hong: Jpn J. Appl. Phys., 2004, 43, 3511-3515.
181. J. Wang, Z. Yue, Z. Gui and L. Li: J. Alloys Compd, 2005, 392, 263-267.
182. D. W. Kim, D. Y. Kim and K. S. Hong: J. Mater. Res., 2000, 15, 1331-1335.
183. D.-W. Kim, H. B. Hong and K. S. Hong: Jpn J. Appl. Phys., 2002, 41, 1465-1469.
184. M.-C. Wu, K.-T. Huang and W.-F. Su: Mater. Chem. Phys., 2006, 98, 406-409.
185. Y.-C. Lee, C.-H. Lin and I.-N. Lin: Mater. Chem. Phys., 2003, 79, 124-128.
186. R. C. Pullar, C. Lai, F. Azough, R. Freer and N. M. Alford: J. Eur. Ceram. Soc., 2006, 26, 1943-1946.
187. D.-W. Kim, H. B. Hong, K. S. Hong, C. K. Kim and D. J. Kim: Jpn J. Appl. Phys., 2002, 41, 6045-6048.
188. H. Sreemoolanathan, M. T. Sebastian and P. Mohanan: Mater. Res. Bull., 1995, 30, 653-658.
189. R. Ratheesh, M. T. Sebastian, P. Mohanan, M. E. Tobar, J. Hartnett, R. Woode and D. G. Blair: Mater. Lett., 2000, 45, 279-285.
190. D.-W. Kim, H. J. Yoon, K. S. Hong and C. K. Kim: Jpn J. Appl. Phys., 2002, 41, 3812-3816.
191. D.-W. Kim, K. S. Hong, C. S. Yoon and C. K. Kim: J. Eur. Cer Soc., 2003, 23, 2597-2601.
192. I. S. Kim, W.-H. Jung, Y. Inaguma, T. Nakamura and M. Itoh: Mater. Res. Bull., 1995, 30, 307-316.
193. C.-S. Chen, C.-C. Chou, C.-S. Chen and I.-N. Lin: J. Eur. Ceram. Soc., 2004, 24, 1795-1798.
194. Q.-L. Zhang, H. Yang and J.-X.Tong: Mater. Lett., 2006, 60, 1188-1191.
195. H.-K. Shin, H. Shin, H. S. Jung, S.-Y. Cho, J.-R. Kim and K. S. Hong: Mater. Res. Bull., 2006, 41, 1206-1214.
196. H. Jantunen, R. Rautioaho, A. Uusimäaki and S. Leppävuori: J. Am. Ceram. Soc., 2000, 83, 2855-2857.
197. H. Jantunen, A. Uusimäki, R. Rautioaho and S. Leppävuori: J. Am. Ceram. Soc., 2002, 85, 697-699.
198. H. Jantunen, A. Uusimäki, R. Rautioaho and S. Leppävuori: J. Eur. Ceram. Soc., 2000, 20, 2331-2336.
199. T. Hu, R. Rautioaho, H. Jantunen, S. Leppävuori, K. Soponmanee and S. Sirisoonthorn: Ceram. Int., 2005, 31, 85-93.
200. Y.-J. Choi, J.-H. Park, J.-H. Park and J.-G. Park: Mater. Lett., 2004, 58, 3102-3106.
201. S. Hirano, T. Hayashi and A. Hattori: J. Am. Ceram. Soc., 1991, 74, 1320-1324.
202. T. Takada, S.-F. Wang, S. Yoshikawa, S.-J. Jang and R. E. Newnham: J. Am. Ceram. Soc., 1994, 77, 2485-2488.
203. J.-H. Jean and S.-S. Lin: J. Am. Ceram. Soc., 2000, 83, 1417-1422.
204. C.-L. Huang and M.-H. Weng: Mater. Res. Bull., 2000, 3, 1881-1888.
205. C.-L. Huang, M.-H. Weng, C.-C. Wu and C.-C. Wei: Jpn J. Appl. Phys., 2001, 40, 698-702.
206. C.-L. Huang, M.-H. Weng and H.-L. Chen: Mater. Chem. Phys., 2001, 71, 17-22.
207. Y.-H. Wang, S.-F. Wang and C.-K. Wen: Mater. Sci. Eng. A, 2006, A426, 143-146.
208. S. X. Zhang, J. B. Li and H. Z. Zhai: Mater. Chem. Phys., 2002, 77, 470-475.
209. G. Bayer: Fortschr. Miner., 1969, 46, 42.
210. M. Udovic, M. Valant and D. Suvorov: J. Eur. Ceram. Soc., 2001, 21, 1735-1738.
211. S. Yamanaka and M. Miyake: J. Less-Common Met., 1990, 159, 179-189.
212. G. Meunier and J. Galy: Acta Crystallogr. Sect. A, Found. Crystallogr., 1971, 27A, 602-608.
213. D.-K. Kwon, M. T. Lanagan and T. R. Shrout: J. Ceram. Soc. Jpn, 2005, 113, 216-219.
214. M. Valant and D. Suvorov: J. Eur. Ceram. Soc. 2004, 24, 1715-1719.
215. D.-K. Kwon, M. T. Lanagan and T. Shrout: J. Am. Ceram. Soc., 2005, 88, 3419-3422.
216. M. Udovic, M. Valant and D. Suvorov: J. Am. Ceram. Soc., 2004, 87, 591-597.
217. M. Valant and D. Suvorov: J. Am. Ceram. Soc., 2001, 84, 2900-2904.
218. O. Yamaguchi, M. Morimi, H. Kawabata and K. Shimizu: J. Am. Ceram. Soc., 1987, 70, C-97-C-98.
219. Y. S. Chang, Y. H .Chang, I. G. Chen, G. J. Chen, Y. L. Chai, S. Wu and T. H. Fang: J. Alloys Compd, 2003, 354, 303-309.
220. K. Haga, T. Ishiji, J. Mashiyama and T. Ikeda: Jpn J. Appl. Phys., 1992, 31, 3156-3159.
221. A. Golovochanski, H. T. Kim and Y. H. Kim: J. Korean Phys. Soc., 1998, 32, S1167-S1169.
222. H. T. Kim, S. H. Kim, S. Nahm, J. D. Byun and Y. Kim: J. Am. Ceram. Soc., 1999, 82, 3043-3048.
223. Q. L. Zhang, H. Yang, J. L. Zoua and H. P. Wang: Mater. Lett., 2005, 59, 880-884.
224. A. Chaouchi, M. Aliouat, S. Marinel, S. D. Astorg and H. Bourahla: Ceram. Int., 2007, 33, 245-248.
225. H. T. Kim, S. Nahm, J. D. Byun and Y. Kim: J. Am. Ceram. Soc., 1999, 82, 3476-3480.
226. Y.-C. Lee, W.-H. Lee and F.-T. Shiao: Jpn J. Appl. Phys., 2004, 43, 7596-7599.
227. Y.-C. Lee and W.-H. Lee: Jpn J. Appl. Phys., 2005, 44, 1838-1843.
228. J.-W. Choi, C.-Y. Kang, S.-J. Yoon, H.-J. Kim, H.-J. Jung and K. H. Yoon: J. Mater. Res., 1999, 14, 3567-3570.
229. P. Liu, E. S. Kim and K. H. Yoon: Jpn J. Appl. Phys., 2001, 40, 5769-5773.
230. P. Liu, H. Ogawa, E. S. Kim and A. Kan: J. Eur. Ceram. Soc., 2003, 23, 2417-2421.
231. J. W. Choi, C. Y. Kang, S. J. Yoon, H. J. Kim and K. H. Yoon: Ferroelectrics, 2001, 262, 1141-1146.
232. P. Liu, E. S. Kim, S. G. Kang and H. S. Jang: Mater. Chem. Phys., 2003, 79, 270-272.
233. J.-Y. Ha, J.-W. Choi, S.-J. Yoon, D. J. Choi, K. H Yoon and H.-J. Kim: J. Eur. Ceram. Soc., 2003, 23, 2413-2416.
234. J.-Y. Ha, J.-W. Choi, C.-Y. Kang, S.-J. Yoon, D. J. Choi and H. J. Kim: Jpn J. Appl. Phys., 2005, 44, 1322-1325.
235. Q. H. Yang, E. S. Kim, Y. J. Kim and P. K. Kim: Mater. Chem. Phys., 2003, 79, 236-238.
236. E. S. Kim, B. S. Chun, J. D. Kim and K. H. Yoon: Mater. Sci. Eng. B, 2003, B99, 243-246.
237. Y. Yoshida, N. Hara, T. Takada and A. Seki: Jpn J. Appl. Phys., 1997, 36, 6818-6823.
238. C.-H. Wei and J.-H. Jean: J. Am. Ceram. Soc., 2003, 86, 93-98.
239. A. Yokoi, H. Ogawa, A. Kan, H. Ohsato and Y. Higashidav: J. Ceram. Soc. Jpn, 2004, 112, S1633-S1636.
240. A. Kan, H. Ogawa, A. Yokoi and H. Ohsato: Jpn J. Appl. Phys., 2003, 42, 6154-6157.
241. A. Yokoi, H. Ogawa, A. Kan, H. Ohsato and Y. Higashida: J. Eur. Ceram. Soc., 2005, 25, 2871-2875.
242. M. Valant, D. Suvorov and A. Meden: J. Am. Ceram. Soc., 1999, 82, 81-87.
243. M. Valant, D. Suvorov and A. Meden: J. Am. Ceram. Soc., 1999, 82, 88-93.
244. M. Valant, D. Suvorov, C. Hoffmann and H. Sommariva: J. Eur. Ceram. Soc., 2001, 21, 2647-2651.
245. M. H. Framcombe and B. Lewis: Acta Crystallogr. Sect. A, Found. Crystallogr., 1958, 11A, 175-178
246. Y. Sakabe, T. Takeda, Y. Ogio and N. Wada: Proc. 10th US - Japanese Semin. on 'Dielectric and piezoelectric ceramics', Providence, RI, USA, September 2001, 63-66.
247. H. T. Kim, T. R. Shrout, C. Rindall and M. Lanagan: J. Am. Ceram. Soc., 2002, 85, 2738-2744.
248. A. Borisevich and P. K. Davies: J. Eur. Ceram. Soc., 2000, 21, 1719-1722.
249. A. Borisevich and P. K. Davies: J. Am. Ceram. Soc., 2002, 85, 2487-2491.
250. A. Borisevich and P. K. Davies: J. Am. Ceram. Soc., 2002, 85, 573-578.
251. D. H. Kang, K. C. Nahm and H. J. Cha: J. Eur. Ceram. Soc., 2006, 26, 2117-2121.
252. Q. Zeng, W. Li, J.-L.Shi, J.-K. Guo, M.-W. Zuo and W.-J. Wu: J. Am. Ceram. Soc., 2006, 89, 1733-1735.
253. Q. Zeng, W. Li, J.-L. Shi and J.-K. Guo: Mater. Lett., 2006, 60, 3203-3206.
254. Q. Zeng, W. Li, J.-L. Shi and J.-K. Guo: J. Am. Ceram. Soc., 2006, 89, 3305-3307.
255. N. Mori, Y. Sugimoto, J. Harada and Y. Higuchi: J. Eur. Ceram. Soc., 2006, 26, 1925-1928.
256. N. Mori, Y. Sugimoto, J. Harada and H. Takagi: J. Ceram. Soc. Jpn Suppl., 2004, 112, (1), S1563-S1566.
257. K. P. Surendran and M. T. Sebastian: J. Appl. Phys. A, 2005, 81A, 823-826.
258. J. Kato, H. Kagata and K. Nishimoto: Jpn J. Appl. Phys., 1992, 31, 3144-3147.
259. S. Kucheiko, J. W. Choi, H. J. Kim, S. J. Yoon and H. J. Jung: J. Am. Ceram. Soc., 1997, 80, 2937-2940.
260. M. Nakano, K. Suzuki, T. Miura and M. Kobayashi: Jpn J. Appl. Phys., 1993, 32, 4314-4318.
261. J.-Y. Ha, J.-W. Choi, H.-J. Kim, S.-J. Yoon and K. H. Yoon: Mater. Chem. Phys., 2003, 79, 261-265.
262. Y. Qiuhong, K. E. Soo and X. Jun: J. Chin. Ceram. Soc., 2002, 31, 554-558.
263. H. M. Zhe, Z. D. Xiang, G. H. Shuang, W. Hão, Z. Tianjing and Z. Bin: Mater. Sci. Eng. B, 2005, B117, 199-204.
264. H. Kagata and J. Kato: Jpn J. Appl. Phys., 1994, 31, 5466-5465.
265. H. J. Kucheiko, H. J. Kim, S. J. Yoon and H. J. Jung: Jpn J. Appl. Phys., 1997, 36, 198-202.
266. K.-W. Kang and H. T. Kim: Mater. Res. Bull., 2006, 41, 1385-1391.
267. N. Krishnamurti and C. Calvo: Can. J. Chem., 1971, 49, 1629-1637.
268. R. Umemura, H. Ogawa, H. Ohsato, A. Kan and A. Yokoi: J. Eur. Ceram. Soc., 2005, 25, 2865-2870.
269. R. Umemura, H. Ogawa, A. Yokoi, H. Ohsato and A. Kan: J. Alloys Compd, 2006, 424, 388-393.
270. R. C. Kerby and J. R. Wilson: Can. J. Chem., 1973, 51, 1032-1040.
271. S. Nomura: Ferroelectrics, 1983, 49, 61-70.
272. T. Kolodiazhnyi, A. Petric, A. Belous, V. Yunov and O. Yancheevskij: J. Mater. Res., 2002, 17, 3182-3189.
273. J. B. Lim, J.-O. Son, S. Nahm, W. S. Lee, M. J. Yoo, N. K. Kang, H. J. Lee and Y. S. Kim: Jpn J. Appl. Phys., 2004, 43, 5388-5391.
274. J.-B. Lim, D.-H. Kim, S. Nahm, J.-H. Paik and H.-J. Lee: Mater. Res. Bull., 2006, 41, 1199-1205.
275. J.-J. Bian, D.-W. Kim and K. S. Hong: Mater. Res. Bull., 2005, 40, 2120-2129.
276. D.-H. Kim, C. An, K.-S. Bang, J.-C. Kim and H.-G. Lee: Solid State Phenomena, 2003, 317, 90-91.
277. C. R. Needs, C. B. Wang, K. W. Hang, M. F. Barker, D. I. Amey, M. A. Smith and K. E. Souders: Proc. Conf. on 'Ceramic interconnect technology', Denver, CO, USA, April 2003, IMAPS, 126.
278. F. Lautzenhiser and E. Amaya: Proc. SPIE - Int. Soc. Optical Eng., 2002, 4828, 143-149.
279. A. Mohanram, S.-J. Lee, G. L. Messing and D. J. Green: J. Am. Ceram. Soc., 2006, 89, 1923-1929.
280. A. Mohanram, S.-J. Lee, G. L. Messing and D. J. Green: Acta Mater., 2005, 53, 2413-5418.
281. R. Zuo, E. Aulbach and J. Rodel: J. Am. Ceram. Soc., 2004, 87, 526-528.
282. G.-Q. Lu, R. C. Sutterlin and T. K. Gupta: J. Am. Ceram. Soc., 1993, 76, 1907-1914.
283. A. Mohanram, G. L. Messing and D. J. Green: Proc. Int. Conf. on 'Microelectronic Packaging Soc. Proc., Washington, DC, USA, 2002, IMAPS, 772-777.
284. T. J. Garino: Proc. SPIE - Int. Soc. Optical Eng., 2003, 5231, 171-176.
285. T. Rabe, W. A. Schiller, T. Hocheimer, C. Modes and A. Kipka: Int. J. Appl. Ceram. Technol., 2005, 2, 374-382.
286. H. Ohsato, T. Tsunooka, Y. Ohishi, Y. Miyauchi, M. Ando and K. Kakimot: J. Korean Ceram. Soc., 2003, 40, 350-353.
287. T. Okawa, M. Imaeda and H. Ohsato: Jpn J. Appl. Phys., 2000, 39, 5645-5649.
288. H. Ohsato, H. Kato, M. Mizuta, S. Nishigaki and T. Okuda: Jpn J. Appl. Phys., 1995, 34, 5413-5417.
289. Y. J. Wu and X. M. Chen: J. Mater. Res., 2001, 16, 1734-1738.
290. J. H. Jang: J. Am. Ceram. Soc., 2004, 87, 1466-1470.
291. M. Ohsahi, H. Ogawa, A. Kan and E. Tanaka: J. Eur. Ceram. Soc., 2005, 25, 2877-2881.
292. C.-C. Chiang, S. F. Wang, Y.-R. Wang and W.-C. J. Wei: Ceram. Int., 2007, to be published.
293. M. M. Krzmanc, M. Valant and D. Suvorov: J. Eur. Ceram. Soc., 2005, 25, 2835-2838.
294. M. M. Krzmanc, A. Meden and D. Suvorov: J. Eur. Ceram. Soc., 2007, 27, 2957-2962.
295. J.-M. Wu and H.-L. Huang: J. Mater. Res., 2000, 15, 222-227.
296. M.-H. Lim, J.-H. Park, H.-G. Kim and M.-J. Yoo: Proc. 7th Int. Conf. on 'Properties and applications of dielectric materials', Nagoya, Japan, June 2003, IEEE, Vol.2, 757-760.
297. J.-L. Zou, Q.-L. Zhang, H. Yang and H.-P. Sun: Jpn J. Appl. Phys., 2006, 45, 4143-4145.
298. G.-K. Choi, J.-R. Kim, S. H. Yoon and K. S. Hong: J. Eur. Ceram. Soc., 2007, 27, 3063-3067.
299. J.-B. Lim, Y. H. Jeong, N.-H. Nguyen, S. Nahm, J.-H. Paik, J.-H. Kim and H.-J. Lee: J. Eur. Ceram. Soc., 2007, 27, 2875-2879.
300. R. Umemura, H. Ogawa and A. Kan: J. Eur. Ceram. Soc., 2006, 26, 2063-2068.
301. S. Nishigaki, S. Yano, H. Kato, T. Hirai and S. Nomura: J. Am. Ceram. Soc., 1988, 71, C11-C17.
302. J. S. Kim, J. C. Lee, C. I. Cheon and C. H. Lee: Proc. Int. Symp. on 'Research reactor and neutron science', Daejeon, Korea, April 2005, 682-685.
303. T. Sugiyama, T. Tsunooka, K. Kakimoto and H. Ohsato: J. Eur. Ceram. Soc., 2006, 26, 2097-2100.
304. E. S. Kim, S.-H. Kim and B. I. Lee: J. Eur. Ceram. Soc., 2006, 26, 2101-2104.
305. Y. Higuchi, Y. Sugimoto, J. Harada and H. Tamura: J. Eur. Ceram. Soc., 2007, 27, 2785-2788.
306. S.-I. Yoo: Proc. Korea - UK Semin. on 'Microwave dielectric materials', Seoul, Korea, February 2003, Seoul Kyoyuk Munhwa-Hoekwan.
307. J. Bang: J. Eur. Ceram. Soc., 2007, 27, 3855-3859.
308. R. C. Pullar, S. Farrah and N. M. Alford: J. Eur. Ceram. Soc., 2007, 27, 1059-1063.
309. S. Thomas and M. T. Sebastian: Mater. Res. Bull., 2007, to be published.
310. D. K. Kwon, M. T. Lanagan and T. R. Shrout: Mater. Lett.,2006,61, 1827-1831.
311. I.-S. Cho, S.-K. Kang, D.-W. Kim and K. S. Hong: J. Eur. Ceram. Soc., 2006, 26, 2007-2010.
312. G.-K. Choi, S.-Y. Cho, J.-S. An and K. S. Hong: J. Eur. Ceram. Soc., 2006, 26, 2011-2015.
313. A. Kan, H. Ogawa and H. Ohsato: J. Ceram. Soc. Jpn Suppl., 2004,11, S1622-S1626.
314. H. Ogawa, A. Yokoi, R. Unemura and A. Kan: J. Eur. Ceram. Soc., 2007, 27, 3099-3104.
315. H. Ogawa, A. Yoki, R. Umemura and A. Kan: J. Eur. Ceram. Soc., 2007, 27, 3099-3104.
316. S. H. Yoon, D.-W. Kim, S.-Y. Cho and K. S. Hong: J. Eur. Ceram. Soc., 2006, 26, 2051-2054.
317. S. J. Hwang, Y.-J. Kim and H. S. Kim: J. Electroceram., 2007, 18, 121-128.
318. R. C. Pullar, J. D. Breeze and N. M. Alford: Key Eng. Mater., 2002, 224-226, 1-4.
319. A. Yang, H. Lin and W. Chen: Jpn J. Appl. Phys., 2006, 45, 1698-1701.
320. W. W. Cho, K. Kakemoto and H. Ohsato: Mater. Sci. Eng. B, 2005,B121, 48-53.
321. P. V. Bijumon, S. Solomon, M. T. Sebastian and P. Mohanan: J. Mater. Sci., 2003, 14, 5-8.
322. Y.-R. Wang, S.-F. Wang and C.-K. Wen: Mater. Sci. Eng. A, 2006,A426, 143-146.
323. Y.-R. Wang, S.-F. Wang and Y.-M. Lin: Ceram. Int., 2005, 31, 905-907.
324. Q. L. Zhang and H. Yang: J. Mater. Sci. Mater. Electr., 2007, to be published.
325. X. Liu, F. Gao, L. Zhao and M. Zhao: J. Electroceram., 2007, 18, 103-109.
326. Y.-C. Choi, J.-H. Park, S. Nahm and J-G. Park: J. Eur. Ceram. Soc., 2007, 27, 2017-2024.
327. H. Shin, H.-K. Shin, H. S. Jung, S.-Y. Cho and K. S. Hong: Mater. Res. Bull., 2005, 40, 2021-2028.
328. J. X. Tong, Q. L. Zhang, H. Yang and J. L. Zou: Mater. Lett., 2005,59, 3252-3255.
329. N. I. Santha and M. T. Sebastian: unpublished work.
330. Y.-L. Chai, Y.-S. Chang, Y.-J. Hsiao and Y.-C. Lian: Mater. Res. Bull., 2008, 43, 257.
331. C.-L. Huang, R. J. Lin and J. H. Wang: Jpn J. Appl. Phys., 2001, 41, 758-762.
332. T. Takada, S. F. Wang, S. Yoshikawa, S.-J. Jang and R. E. Newnham: J. Am. Ceram. Soc., 1994, 77, 1909-1916.
333. M.-H. Kim, S. Nahm, W. S. Sung, M.-J. Yoo, N.-K. Kang, H.-T. Kim and H.-J. Lee: Jpn J. Appl. Phys., 2005, 44, 3091-3094.
334. E. Guan, W. Chen and L. Luo: Ceram. Int., 2007, 33, 1145-1148.
335. Y.-C. Lee, W.-H. Lee and F.-S. Shieuc: Jpn J. Appl. Phys., 2002, 41, 6049-6053.
336. Y.-C. Lee, W.-H. Lee and F.-S. Shiuc: J. Eur. Ceram. Soc., 2005, 25,3459-3468.
337. Y.-C. Lee, W.-H. Lee and F.-S. Shieuc: Jpn J. Appl. Phys., 2003, 42,1311-1314.
338. J. J. Jiang, H. B. Gao and X. W. Wang: Mater. Res. Bull., 2004, 39, 2127-2135.
339. P. S. Anjana and M. T. Sebastian: unpublished work.
340. M. H. Kim, J. H. Jeong, S. Nahm, H. T. Kim and H. J. Lee: J. Eur. Ceram. Soc., 2006, 26, 2139-2142.
341. D.-W. Kim, D.-G. Lee and K. S. Hong: Mater. Res. Bull., 2001, 36, 585-595.
342. S. O. Yoon, J. H. Yoon, K. S. Kim, S. H. Shim and Y. K. Pyeon: J. Eur. Ceram. Soc., 2006, 26, 2031-2034.
343. J.-X. Tong, Q.-L. Zhang, H. Yang and J.-L. Zou: J. Am. Ceram. Soc., 2007, 90, 845-849.
344. E. S. Kim and W. Choi: J. Eur. Ceram. Soc., 2006, 26, 1761-1766.
345. D.-H. Kim, S.-K. Lim, C. An, Y.-S. Lee, K.-S. Bang, J.-C. Kim and H.-K. Lee: Proc. 7th Int. Conf. on 'Solid dielectrics', Eindhoven, Netherlands, June 2001, IEEE, 195-199.
346. J.-B. Lim, S. Nahm, H.-T. Kim, J.-H. Kim, J.-H. Paik and H.-J. Lee: J. Electroceram., 2006, 17, 393-397.
347. I. Nishigaki et al.: Proc. 3rd US - Japan Semin. on 'Dielectric and piezoelectric ceramics', Toyama, Japan, November 1986, 55.
348. D.-W. Kim, H. B. Hong and K. S. Hong: Jpn J. Appl. Phys., 2002,41, 1465-1469.
349. D.-W. Kim, J-R. Kim, S-H.Yoon, K. S. Hong and C. K. Kim: J. Am. Ceram. Soc., 2002, 85, 2759-2762.
350. P. Liu, H. Ogawa, E. S. Kim and A. Kan: J. Eur. Ceram. Soc., 2004, 24, 1761-1768.
351. J.-R. Kim, D. W. Kim, H. S. Jung and K. S. Hong: J. Eur. Ceram. Soc., 2006, 26, 2105-2109.
352. J.-R. Kim, D.-W. Kim, S. H. Yoon and K. S. Hong: J. Electroceram., 2006, 17, 439-443.
353. Q. Zeng, W. Li, J.-L. Shi and J.-K. Guo: Mater. Lett., 2006, 60, 3203-3206.
354. D. Shihua, Y. Xi and Y. Yang: Ceram. Int., 2004, 30, 1195-1198.
355. Y. Mão, S. H. Ding, X. Yão and L. Y. Zhang: Mater. Chem. Phys., 2006, 98, 198-202.
356. S. Hirano, T. Hayashi, K. Kikuta and J. Otsuka: Ceram. Trans., 1990, 12, 733-740.
357. Q.-L. Zhang and H. Yang: Mater. Res. Bull., 2005, 40, 1891-1898.
358. P. Liu, H. Zhang, H. Ogawa and E. S. Kim: Phys. Status Solidi A, 2004, 201A, 2175-2179.
359. F. Zhao, Z. Yue, J. Pei, Z. Gui and L. Li: J. Solid State Chem., 2006,179, 1720-1726.
360. H. P. Wang, Q. L. Zhang, H. Yang and J. L. Zhou: Electron. Compon. Mater., 2004, 23, 4.
361. Q. Zeng, W. Li, J. L. Shi, X. L. Dong, J.-K. Guo: Mater. Res. Bull., 2008, 43, 411.
362. H. B. Hong, D. W. Kim and K. S. Hong: Jpn J. Appl. Phys., 2003, 42, 5172.
363. K.-W. Wang, H. T. Kim, M. Lanangan and T. Shrout: Mater. Res. Bull., 2006, 41, 1385-1391.
364. C. Qin, Z. Yue, Z. Gui and L. Li: Mater. Sci. Eng. B, 2003, B99, 286-289.
365. P. Samoukhina, S. Kamba, S. Santhi, J. Petzelt, M. Valant and D. Suvorov: J. Eur. Ceram. Soc., 2005, 25, 3085-3088.
366. Y. J. Wu and X. M. Chen: J. Mater. Res., 2001, 16, 1734-1738.
367. D. H. Kang, K. C. Nam and H. J. Cha: J. Eur. Ceram. Soc., 2006,26, 2117-2121.
368. D. K. Yim, J.-R. Kim, D.-W. Kim and K. S. Hong: J. Eur. Ceram. Soc., 2007, 27, 3053-3057.
369. E. S. Kim, H. S. Park and K. H. Kim: Mater. Chem. Phys., 2003, 79, 213-217.
370. Q. Zeng, W. Li, J.-L. Shi, J.-K. Guo, H. Chen and M.-L. Liu: J. Eur. Ceram. Soc., 2007, 27, 261-265.
371. Y. Ota, K. Kakimoto, H. Ohsato and T. Okawa: J. Eur. Ceram. Soc., 2003, 24, 1755-1760.
372. A.-K. Axelsson and N. M. Alford: J. Eur. Ceram. Soc., 2006, 26, 1933-1936.
373. G. Huang, D. Zhou, J. Xu, Z. Zheng and S. Gong: Mater. Res. Bull., 2005, 40, 13-19.
374. M. Valant and D. Suvorov: J. Am. Ceram. Soc., 2003, 86, 939-944.
375. E. S. Kim, J. S. Jeon and K. H. Yoon: J. Eur. Ceram. Soc., 2003, 23, 2583-2587.
376. S. L. Schwartz and T. R. Shrout: US Patent 5449652, 1995, USA.
377. A.-K. Axelsson, M. T. Sebastian and N. M. Alford: J. Korean Ceram. Soc., 2003, 40, 340-345.