Coupling behavior between transmission lines with meshed ground planes in LTCC-MCMs

Microwave Journal

Volumn 41, Issue 11, 1998, Pages 70-79

  Thust, H ^a   Drue K H ^a   Muller J ^a   Thelemann, T ^a   Tuschick, T ^a   Chilo, J ^b   Golovanov, C ^b   Ndagijimana, F ^b  

^a ILMENAU UNIVERSITY OF TECHNOLOGY   (Germany)

^b Grenoble INP Phelma   (France)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; COMPUTER SIMULATION; TIME DOMAIN ANALYSIS;

LOW TEMPERATURE COFIRED CERAMICS (LTCC);

MULTICHIP MODULES;

EID: 0032207944     PISSN: 01926225     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (4)

1. B. Mussler and D. Schwanke, "Recent Development of Nonactive Integrated Components in Multilayer Modules," Proceedings of the International Symposium on Tantalum and Niobium, Goslar, September 24-28, 1995.
2. J. Müller et al., "Line Impedance Control in MCM-Cs with Meshed Ground/Power Planes," Proceedings of the International Conference on Multichip Modules, Denver, CO, April 1996.
3. F. Ndagijimana and P. Saguet, "The Use of a Full-wave 3-D Technique in a CAD-oriented Analysis: The TLM Method," Software Applications in Electrical Engineering, Computational Mechanics Publications, Southampton, 1993.
4. C. Boussetta, F. Ndagijimana, J. Chilo and P. Saguet, "Electrical Modeling Packaging Discontinuities: A General Methodology Based on the Three-dimensional TLM Concept," International Journal of Microwave and Millimeter-wave Computer-aided Engineering, John Wiley & Sons Inc., Vol. 5, No. 2, 1995, pp. 93-103.