Microstructural effects on microwave properties of low-temperature cofired ceramic striplines: Experiments and modeling

Journal of the American Ceramic Society

Volumn 87, Issue 8, 2004, Pages 1466-1470

  Jang, Jae Hyuk ^a  

^a Samsung Electro Mechanics   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRIC CONDUCTIVITY; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; HEATING; INTERFACES (MATERIALS); MATHEMATICAL MODELS; MICROSTRIP LINES; MICROSTRUCTURE; PERMITTIVITY;

CONDUCTOR DIELECTRIC INTERFACE; CONDUCTOR LINES; HIGH FREQUENCY SIMULATION SOFTWARE; LOW TEMPERATURE COFIRED CERAMICS; MICROSTRUCTURAL EFFECTS; MICROWAVE PROPERTIES; STRIPLINE PACKAGES;

CERAMIC MATERIALS;

EID: 4544367960     PISSN: 00027820     EISSN: None     Source Type: Journal    
DOI: 10.1111/j.1551-2916.2004.01466.x     Document Type: Article

References (20)

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